Indentation damage evaluation on metal-coated thin-films stacked structure

Yeo, Anders; Liu, Mao; Zhou, Kun

doi:10.1557/jmr.2015.278

Cited by 9 publications

(2 citation statements)

References 40 publications

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“…The specimens were glued onto a piezo-electronic acoustic emission (AE) sensor with an operating frequency of 100-450 kHz that was connected to a Vallen AMSY-6 system. [21] The AE sensor was firmly positioned in the fixture, which was mounted on the motorized x-y-z tables of the micro-indentation tester. The AE sensor could capture any event caused by the indentation loading, which allowed to collect data before damaging the specimens.…”

Section: Instrumentationmentioning

confidence: 99%

A new method for the dynamic deformation characterization of thin-film stacked structures

et al. 2021

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The dynamic deformation of thin-film stacked structures in the bond pad of microelectronic devices usually occurs when the contact load rapidly increases during the wire-bonding process. This work developed dynamic strain rate model for analyzing the dynamic response of thin-film stacked structures at varying loading rates. Dynamic strain rate tests were performed by maintaining the ratio of instantaneous load rate to load. The indentation stress-strain curves at different testing protocols were plotted. We found that the deformation decreased as the prescribed rate increased because of the rate-dependent characteristics of the thin Cu film.

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Section: Instrumentationmentioning

confidence: 99%

A new method for the dynamic deformation characterization of thin-film stacked structures

et al. 2021

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“…These include digital speckle pattern interferometry [26] [27] and capacitive plate transducers [28] which measure the local displacement or penetrating depth of the indentation field generated by the tester. Another example of this is where the indentation damage effects were also measured by an indenter equipped with an AE sensor [29] [30].…”

Section: Micro-and Nano-indentation Testingmentioning

confidence: 99%

Advances in test and measurement of the interface adhesion and bond strengths in coating-substrate systems, emphasising blister and bulk techniques

et al. 2019

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In this paper, recent advances in the minimum-destructive testing of the adhesion of coating-substrate systems are reviewed, focusing on key techniques such as micro-and nano-scale levels of indentation, scratching, laser-induced wave shock, as well as the blister and buckle approach. Along with adhesion failure tests, the latest and most extensive applications of the adhesion test methods in nano-, micro-and bulkcoating technology and the associated techniques to determine the minimum damage defects left on the coatings are discussed and their use reviewed.

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Prediction of remaining fatigue life of metal specimens using data-driven method based on acoustic emission signal

Li,

Cao,

Chen

et al. 2023

Applied Acoustics

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Indentation damage evaluation on metal-coated thin-films stacked structure

Abstract: Abstract

Cited by 9 publications

References 40 publications

A new method for the dynamic deformation characterization of thin-film stacked structures

A new method for the dynamic deformation characterization of thin-film stacked structures

Advances in test and measurement of the interface adhesion and bond strengths in coating-substrate systems, emphasising blister and bulk techniques

Prediction of remaining fatigue life of metal specimens using data-driven method based on acoustic emission signal

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