Indium Phosphide Integrated Photonics in Membranes

Tol, J.J.G.M. van der; Jiao, Yuqing; Shen, L.; Millan-Mejia, A.J.; Pogoretskii, Vadim; Engelen, Jorn P. van; Smit, M.K.

doi:10.1109/jstqe.2017.2772786

Cited by 55 publications

(51 citation statements)

References 37 publications

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“…However, the lower limit will be imposed by the resolution of our electrical drivers and the noise of the readout system. In (6) we see the central differences equation to get a significantly better approximation of the gradient. However, the number of computational steps is almost doubled when compared to (5).…”

Section: A Derivative Methods (First-order Optimization Algorithms)mentioning

confidence: 96%

“…As the reader can infer, getting the gradient straightforwardly in a real waveguide mesh system, as proposed, implied performing the perturbation of one actuating variable, getting the associated CF from the postprocessed signal from the readout system, repeating the procedure with a negative perturbation and then computing (6). Then, this procedure is iterated for every optimization variable till getting the full vector g. Next, we apply (5) to get the next actuation driving variables ν t and if the exiting conditions are not achieved, we iterate again.…”

Section: A Derivative Methods (First-order Optimization Algorithms)mentioning

confidence: 99%

“…Photonics is not an exception. Closely mimicking the past electronic trends, in the last 50 years, light-based systems have evolved from the first proposals of discrete integrated components to the growth of a complete ecosystem tailored to produce Application Specific Photonic Integrated Circuits (ASPICs), [6][7]. As in electronics integrated circuits, the up-front non-recurring engineering costs (NRE) including custom mask tooling, design hours and specific process developments reduce the cost effectiveness for low-volume applications.…”

Section: Introductionmentioning

confidence: 99%

See 2 more Smart Citations

Programmable Integrated Silicon Photonics Waveguide Meshes: Optimized Designs and Control Algorithms

López

2020

IEEE J. Select. Topics Quantum Electron.

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Programmable Integrated Photonics is a recent area of research that aims to integrate a very-large scale of reconfigurable photonic resources to enable flexible and versatile photonic integrated circuits. In this paper we review the state of the art of general-purpose waveguide mesh arrangements with a special focus on those that allow the synthesis of optical feedback loops. Moreover, we propose for the first time three alternative waveguide mesh topologies that decouple the performance and the geometry of previously reported architectures while achieving a higher-component density integration. This innovation is of special relevance to mitigate one of the main scalability limitations, the integration area. The paper finalizes with an introduction to control algorithms for waveguide mesh arrangements based on derivative methods and non-derivative methods. These control methods provide a proof for the self-reconfiguration of large-scale waveguide mesh arrangements. In particular, we apply the computational optimization algorithms to program an hexagonal waveguide mesh to emulate a 1x8 beamforming network and an optical filter based on an unbalanced MZI design. All in all, the paper comprises recipes to achieve truly practical softwaredefined photonic integrated circuits.

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Section: A Derivative Methods (First-order Optimization Algorithms)mentioning

confidence: 96%

Section: A Derivative Methods (First-order Optimization Algorithms)mentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

See 1 more Smart Citation

Programmable Integrated Silicon Photonics Waveguide Meshes: Optimized Designs and Control Algorithms

López

2020

IEEE J. Select. Topics Quantum Electron.

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“…Monolithical integration of light sources and detectors with Si-Ph PICs has been demonstrated in lab, but it is currently not readily accessible for most users [98][99][100][101][102].…”

Section: Near-infraredmentioning

confidence: 99%

Opportunities for photonic integrated circuits in optical gas sensors

Hänsel

Heck

2020

J. Phys. Photonics

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In this article, the potential of photonic integrated circuits (PICs) for modern gas sensing applications is discussed. Optical detection systems can be found at the high-end of the currently available gas detectors, and PIC-based optical spectroscopic devices promise a significant reduction in size and cost. The performance of such devices is reviewed here. This discussion is not limited to one semiconductor platform, but includes several available platforms operating from the visible wavelength range up to the long wavelength infrared. The different platforms are evaluated regarding their capabilities in creating a fully integrated spectroscopic setup, including light source, interaction cell and detection unit. Advanced spectroscopy methods are assessed regarding their PIC compatibility. Based on the comparison of PICs with state-of-the-art bulk optical devices, it can be concluded that they can fill the application space of compact and low cost optical gas sensors.

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“…However, limitations of silicon for realizing efficient on-chip light sources mean that light either has to be coupled into the PIC from an external light source [2], or a different material capable of efficient light emission has to be integrated on silicon [3]. Perfect candidates for realizing active functionality of the on-chip photonic devices combined with silicon strengths are direct-bandgap group III-V semiconductors [4].…”

Section: Introductionmentioning

confidence: 99%

Comparison of processing-induced deformations of InP bonded to Si determined by e-beam metrology: Direct vs. adhesive bonding

Sakanas

Semenova

Ottaviano

et al. 2019

Microelectronic Engineering

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In this paper, we employ an electron beam writer as metrology tool to investigate distortion of an exposed pattern of alignment marks in heterogeneously bonded InP on silicon. After experimental study of three different bonding and processing configurations which represent typical on-chip photonic device fabrication conditions, the smallest degree of linearly-corrected distortion errors is obtained for the directly bonded wafer, with the alignment marks both formed and measured on the same InP layer side after bonding (equivalent to single-sided processing of the bonded layer). Under these conditions, multilayer exposure alignment accuracy is limited by the InP layer deformation after the initial pattern exposure mainly due to the mechanical wafer clamping in the e-beam cassette. Bonding-induced InP layer deformations dominate in cases of direct and BCB bonding when the alignment marks are formed on one InP wafer side, and measured after bonding and substrate removal from another (equivalent to double-sided processing of the bonded layer). The findings of this paper provide valuable insight into the origin of the multilayer exposure misalignment errors for the bonded III-V on Si wafers, and identify important measures that need to be taken to optimize the fabrication procedures for demonstration of efficient and high-performance on-chip photonic integrated devices.

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Indium Phosphide Integrated Photonics in Membranes

Cited by 55 publications

References 37 publications

Programmable Integrated Silicon Photonics Waveguide Meshes: Optimized Designs and Control Algorithms

Programmable Integrated Silicon Photonics Waveguide Meshes: Optimized Designs and Control Algorithms

Opportunities for photonic integrated circuits in optical gas sensors

Comparison of processing-induced deformations of InP bonded to Si determined by e-beam metrology: Direct vs. adhesive bonding

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