Inductively Coupled Plasma Etching of Complementary Barrier Infrared Detector Focal Plane Arrays for Long-Wave Infrared Imaging

Abstract

We report on the details of inductively coupled plasma etching for achieving low dark current long-wavelength infrared focal plane arrays (FPAs). External factors that influence the etching process are studied. A high-quality hard mask for excellent pattern transfer is discussed. Next, a suitable mounting technique for good thermal contact is described. Finally, the challenges and differences between etching large 200-µm test diodes and small 28-µm FPA pixels are discussed. The complete etching process is then demonstrated on a 320 × 256 complementary barrier infrared detector FPA. The mean dark current density of 2.2 × 10 −4 A/cm 2 is measured at an operating bias of 128 mV with a 50% cutoff wavelength of 8.8 µm. Good imagery is achieved with an array yielding an 81% fill factor with 97% operability. Operating at T = 80 K, the measured mean noise equivalent differential temperature is 18.6 mK, and the mean detectivity is D * = 1.3 × 10 11 cm-Hz 1/2 /W. Index Terms-Dry etching, focal plane arrays (FPA), long-wave infrared, superlattice detectors.

Enhanced Temperature Control Method Using ANFIS with FPGA

“…In recent years, researchers have discussed the etching process and analyzed the characteristics of the ICP-type etcher [ 1 – 6 ]. Temperature diagnostics for bell-jar-top ICP has been carried out using atomic emission spectroscopy [ 2 ].…”