Influence of assembly parameters on lead-free solder joints reliability in Package-on-Package (PoP) technology

Sitek, J.; Stęplewski, W.; Janeczek, Kamil; Kościelski, M.; Lipiec, K.; Ciszewski, Piotr; Krzaczek, Tomasz

doi:10.1108/ssmt-03-2015-0011

Cited by 10 publications

(6 citation statements)

References 1 publication

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“…Similar to those used in the publication (Sitek et al , 2015), lead-free PoP components made by Amkor Technology (A-PSvfBGA353-.5-14 mm-DC-LF-125 and A-PoP152-.65 mm-14 mm-DC-LF-105) were selected for PoP systems manufacture. They were the PSvfBGA-type enclosures [package stackable very thin fine pitch ball grid array (BGA)] with a pitch of 0.5 mm, which formed the basis of the system (CPU) on which the PoP package was mounted, also in a housing of the BGA with pitch 0.65 mm and with SAC105 balls.…”

Section: Test Methodologymentioning

confidence: 99%

“…PoP technology requires much attention and knowledge in the areas of soldering material selection and design of the technological operations. The equipment also has a crucial role; a high precision assembly machine that contains modules for PoP technology and a modern soldering oven are both essential (Koscielski et al , 2015; Sitek et al , 2015).…”

Section: Introductionmentioning

confidence: 99%

“…Flux for PoP was also used in the assembly process for comparison. The conclusions from earlier studies described in Koscielski et al (2015) and Sitek et al (2015) were applied during the design of experiments (DoE) planning and for the soldering materials selection.…”

Section: Introductionmentioning

confidence: 99%

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The dependence of reliability and mechanical strength of the solder joints in 3D PoP structures from sizes of solder powders applied in soldering materials

Sitek

Kościelski

Borecki

et al. 2017

SSMT

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Purpose The purpose of this paper is to evaluate the influence of solder powders sizes applied in soldering materials used for Package-on-Package (PoP) system manufacture as well as other factors on reliability and mechanical strength of created solder joints in three-dimensional (3D) PoP structures. Design/methodology/approach The design of experiments based on the Genichi Taguchi method were used in the investigation. The main factors covered different printed circuit board (PCB) coatings, soldering materials with solder powders sizes from Types 3 to 7 and soldering profiles. The reliability of 3D PoP structures was determined by measurements of resistance of daisy-chain solder joints systems during thermal shocks (TS) cycles. The mechanical strength of solder joints in 3D PoP structures was determined by measurements of a shear force of “Top” layer of 3D structures at T0 and after 1,500 TS. The ANOVA was used for results assessment. Findings The size of solder powders applied in soldering materials had small (10 per cent) influence on mechanical strength of solder joints in 3D PoP structures. Small size of solder powder had positive effect on solder joints reliability in 3D PoP structures. Especially important was the selection of solder paste for “Bottom” layer of 3D PoP system (influence 17 per cent). Incorrect soldering profile (influence 46 per cent) or wrong selected PCB coating (influence 35 per cent) can very easily reduce the positive impact of soldering materials on solder joints reliability. It was stated that as low as possible soldering profile and organic solderability preservative (OSP) coating in the case of single-sided PCB are the best for 3D PoP structures due to their reliability. Originality/value This paper explains how different sizes of solder powders used nowadays in solder pastes influence on reliability and mechanical strength of the solder joints in 3D PoP structures. The contribution, in numerical values, of soldering materials, soldering profile and PCB coating on 3D PoP structures solder joints reliability as well as recommendations improving reliability of 3D PoP structures solder joints were presented.

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Section: Test Methodologymentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

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The dependence of reliability and mechanical strength of the solder joints in 3D PoP structures from sizes of solder powders applied in soldering materials

Sitek

Kościelski

Borecki

et al. 2017

SSMT

Self Cite

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“…The dipping procedure of the upper element of the PoP system covered the same conditions for all investigated variants (50 per cent depth, 1 second time of dipping). More details concerning the assembly procedure and its influence on solder joint reliability were reported in a previous paper (Sitek et al, 2014).…”

Section: Investigation Of Soldering Procedures For Pop Systemsmentioning

confidence: 99%

Materials and soldering challenges in lead-free Package-on-Package (PoP) technology

Kościelski

Sitek

Stęplewski

et al. 2015

Soldering &Amp; Surface Mount Technology

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If you would like to write for this, or any other Emerald publication, then please use our Emerald for Authors service information about how to choose which publication to write for and submission guidelines are available for all. Please visit www.emeraldinsight.com/authors for more information. About Emerald www.emeraldinsight.comEmerald is a global publisher linking research and practice to the benefit of society. The company manages a portfolio of more than 290 journals and over 2,350 books and book series volumes, as well as providing an extensive range of online products and additional customer resources and services.Emerald is both COUNTER 4 and TRANSFER compliant. The organization is a partner of the Committee on Publication Ethics (COPE) and also works with Portico and the LOCKSS initiative for digital archive preservation. AbstractPurpose -The purpose of this paper is to present challenges met during package-on-package (PoP) technology implementation in real surface-mount technology assembly processes. Design/methodology/approach -The properties and behavior of different combinations of soldering materials, PoP components and soldering profiles were investigated, both in the laboratory and during production trials. The purpose of such an approach was identification of existing problems and challenges in lead-free PoP systems assembly as well as checking which soldering material designed to PoP is more suitable for this technology. Findings -Technological trials are needed to select adequate soldering materials for PoP systems assembly, as laboratory tests of materials alone were not sufficient. The challenges of PoP technology were associated with the equipment utilized, the soldering materials, operational parameters and the soldering profile used for assembly. The localization of defects in PoP systems is very difficult and, in many cases, destructive methods have to be used on solder joints for the assessment and confirmation of failures. Originality/value -This paper shows main materials and soldering challenges in lead-free PoP technology. In particular, the problem related with selection of soldering materials and soldering profiles for PoP was presented. Moreover, the issues that have to be taken into consideration during the planning of a PoP system assembly procedure are presented.

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“…In the recent years, one of the main trends that appeared in designing and production of electronic devices is their miniaturization, which aims at achieving their greater functionality combined with smaller dimensions. Today, this goal can be attained using multilayer technologies, such as multichip modules MCM-C, MCM-D, MCM-L, MCM-Si or MCM-P (Winiarski et al, 2015;Doane and Franzon, 1993;Shan et al, 2015;Merkle and Götzen, 2015) or threedimensional packaging approaches (Sitek et al, 2015;Schwerz et al, 2014) such as package on package, system on chip or system in package. Other solutions concern passive components (resistors, capacitors and inductors), which are the main components assembled in electronic devices.…”

Section: Introductionmentioning

confidence: 99%

Thermal stability analysis of passive components embedded into printed circuit boards

Stęplewski

Dziedzic

Janeczek

et al. 2018

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Purpose The purpose of this paper is to investigate the behavior of embedded passives under changing temperature conditions. Influence of different temperature changes on the basic properties of embedded passives was analyzed. The main reason for these investigations was to determine functionality of passives for space application. Design/methodology/approach The investigations were based on the thin-film resistors made of Ni-P alloy, thick-film resistors made of carbon or carbon-silver inks, embedded capacitors made of FaradFlex materials and embedded inductor made in various configurations. Prepared samples were examined under the influence of a constant elevated temperature (100, 130 or 160°C) in a long period of time (minimum of 30 h), thermal cycles (from −40 to +85°C) or thermal shocks (from −40 to +105°C or from −40 to +125°C). Findings The achieved results revealed that resistance drift became bigger when the samples were treated at a higher constant temperature. At the same time, no significant difference in change in electrical properties for 50 and 100 Ω resistors was noticed. For all the tests, resistance change was below 2 per cent regardless of a value of the tested resistors. Conducted thermal shock studies indicate that thin-film resistors, coils and some thick-film resistors are characterized by minor variations in basic parameters. Some of the inks may show considerable resistance variations with temperature changes. Significant changes were also exhibited by embedded capacitors. Originality/value The knowledge about the behavior of the operating parameters of embedded components considering environmental conditions allow for development of more complex systems with integrated printed circuit boards.

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Influence of assembly parameters on lead-free solder joints reliability in Package-on-Package (PoP) technology

Cited by 10 publications

References 1 publication

The dependence of reliability and mechanical strength of the solder joints in 3D PoP structures from sizes of solder powders applied in soldering materials

The dependence of reliability and mechanical strength of the solder joints in 3D PoP structures from sizes of solder powders applied in soldering materials

Materials and soldering challenges in lead-free Package-on-Package (PoP) technology

Thermal stability analysis of passive components embedded into printed circuit boards

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