Influence of Chemical Pretreatment of Epoxy Polymers on the Adhesion Strength of Electrochemically Deposited Cu for Use in Electronic Interconnections

Abstract

Epoxy polymers are frequently used for electronic purposes, in particular for built up layers and micro-vias in advanced printed circuit boards. The adhesion of the plated metal layers to this polymer surface is of prime importance for the reliability of the interconnection. Chemical treatment of the polymer surface changes the chemical and physical nature of the polymer. This results in specific groups of the polymer chain present on the surface and changes the roughness of the polymer layer. The influence of swellers and oxidizing agents on the polymer surface roughness and the chemical properties of the surface are investigated. The surface is analyzed by atomic force microscopy, attenuated total reflectance-infrared ͑ATR-IR͒ spectroscopy, dynamic contact analyses ͑DCA͒, and peel strength measurements after electroless and electroplating of the surface. The changing of the chemical functionalities on the surface, which is detected by ATR-IR and DCA plays an important part in the adhesion strength of electrochemically plated copper. The combination of roughness and the presence of certain chemical groups, like alcohols, play an important role in the adhesion of electrochemically deposited metals to the polymer surface.

Toward a computational and experimental model of a poly-epoxy surface

“…A selection amongst the wealth of publications can be found in Refs. [5][6][7][8][9][10][11][12][13][14][15][16].…”

Study of the Failure Mechanism of the Cu/Epoxy Interface After Modifications by Means of Surface Chemical Reactions

“…This peel test was performed using a Dage Series 4000 with a TP 5 kg cartridge. Further details about the peel strength measuring mechanism and the used plating can be found in previous publications (1,5). …”

Composition-dependent curing behavior and peel strength of epoxy resins for printed circuit boards (PCBs)

“…To achieve a fine pattern on the outer layer of HHP PCBs, a new process is required. [1][2][3][4] Currently, a build-up insulating film method is used to produce finer patterns on the outer layer of HHP PCBS. This method comprises five main processes: lamination of the build-up insulating film, pre-curing, desmearing, electroplating, and making the electric circuit.…”