2007
DOI: 10.1149/1.2434682
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Influence of Chloride Anions on the Mechanism of Copper Electrodeposition from Acidic Sulfate Electrolytes

Abstract: We investigate the influence of chloride Cl − ions in a broad range of chloride concentrations on the kinetics and mechanism of copper electrodeposition from sulfate-based acidic electrolytes. Chloride ions influence copper deposition through two competitive effects: at low Cl − concentration ͑few mM͒, chloride ions depolarize the Cu reduction process, while higher Cl − concentrations induce complexation of copper species and cause a cathodic polarization of the deposition process. Cu reduction proceeds throug… Show more

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Cited by 97 publications
(86 citation statements)
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“…25 On the other hand, chloride ion plays another role of reducing the activation energy of cupric ions reduction by cuprous chloride formation. 26 Chloride ions accelerate copper electrodeposition, 26 but they were not uniformly distributed on the copper surface. According to the mass transfer of chloride ion, only convection term is beneficial to the chloride ion transport forward to the cathodic surface during electroplating.…”
Section: Resultsmentioning
confidence: 99%
“…25 On the other hand, chloride ion plays another role of reducing the activation energy of cupric ions reduction by cuprous chloride formation. 26 Chloride ions accelerate copper electrodeposition, 26 but they were not uniformly distributed on the copper surface. According to the mass transfer of chloride ion, only convection term is beneficial to the chloride ion transport forward to the cathodic surface during electroplating.…”
Section: Resultsmentioning
confidence: 99%
“…serves as an electrolyte necessary for E-chem reactions and chloride ions are able to stabilize Cu 2+ ions in the form of copper(I) (Cu + ) chloride complexes. 37 This is evidenced by a red shied absorption band of CuSO 4 in concentrated NaCl (aq. ), together with a color change from blue to green (Fig.…”
Section: Ucl Sensing Without E-chem Assistancementioning
confidence: 99%
“…Such effects are widely reported in the literature, and relevant examples are briefly discussed here. Chloride adsorbates on Cu(100) surfaces strongly influence the surface morphology, inducing the formation of flat, strongly faceted terraces along the {100} directions [73], and also increasing adatom mobility; the adsorbate structure affects Cu deposition and dissolution, resulting, for example, in a different deposition mechanism [74] and a distinct morphology of electroplated Cu films [75]. Reconstruction of the Au(111) surface depends not only on the applied potential but is also affected by anions in the electrolyte [76]; the resulting interplay between applied potential, reconstruction, and anion coverage significantly affects subsequent UPD and growth processes.…”
Section: Ion Adsorption At the Electrode/electrolyte Interfacementioning
confidence: 99%