Influence of Complexing Agents on Morphologies and Mechanical Properties of Nanoporous Copper/Nickel

Yi, Xiaoyin; Yang, Qing

doi:10.1380/ejssnt.2018.310

Cited by 2 publications

(1 citation statement)

References 19 publications

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“…In recent years, paramagnetic Cu has replaced Al as a metal for interconnects material for the microelectronics industry due to its high thermal and electrical conductivity compared with Al [1,2]. Cu metal can be deposited by several methods, such as physical vapor deposition, chemical vapor deposition, electroless deposition, and electrodeposition [3]. Electrodeposition is an established production method for thin metal films and for surface finishing [4].…”

Section: Introductionmentioning

confidence: 99%

Electrodeposition of Paramagnetic Copper Film under Magnetic Field on Paramagnetic Aluminum Alloy Substrates

Soegijono

Susetyo

Yusmaniar

et al. 2020

e-J. Surf. Sci. Nanotechnol.

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Electrodeposition of paramagnetic copper (Cu) from a sulfate solution was investigated under magnetic fields and two different current densities. Static magnetic fields have been used during electrodeposition of paramagnetic Cu onto paramagnetic aluminum (Al) substrate to enhance the deposition rate and to alter crystallographic orientation and morphology of the film. The magnetic field might be attributed to the field-induced convection that disrupts the depletion layer near the electrode and that might also be correlated to Cu, Al, and oxygen dissolved in the solution as paramagnetic materials. An X-ray diffractometry, a scanning electron microscope with energy dispersive spectrometry, a potentiostat, and a digital camera were used for characterizing the crystal structure, morphology, the electrochemical behavior, and wettability, respectively. The results show that, at the current density of 10 mA cm −2 , raising the magnetic field from 800 to 1400 G increases the cathode current efficiency and alters the electrochemical behavior, the crystal growth, and the crystallite size. At the current density of 30 mA cm −2 , the magnetic field alters the growth and crystallographic orientation. The static magnetic field exposed during electrodeposition of Cu onto the Al alloy can control the film properties, especially crystallographic orientation and the oxygen content.

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Section: Introductionmentioning

confidence: 99%

Electrodeposition of Paramagnetic Copper Film under Magnetic Field on Paramagnetic Aluminum Alloy Substrates

Soegijono

Susetyo

Yusmaniar

et al. 2020

e-J. Surf. Sci. Nanotechnol.

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The effect of chelators on additives in the surface characterization and electrochemical properties of an eco-friendly electroless copper nano deposition

Jayalakshmi

Venkatesan

Deepa

et al. 2023

Sci Rep

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We represent the results of a study on as the chelators used in the environmentally friendly electroless deposition bath changed depending on the amounts of hydroxides were present. The baths were prepared using polyhydroxides, glycerol and sorbitol, as chelators with copper methanesulfonate as the metal ion. Dimethylamine borane (DMAB) was used as the reducing agent with N-methylthiourea and cytosine, as additives in both the glycerol and sorbitol contained baths. Potassium hydroxide was used as the pH adjuster, with glycerol and sorbitol baths maintained at a pH of 11.50 and 10.75 respectively at a room temperature of 28 ± 2 °C. XRD, SEM, AFM, cyclic voltammetry studies, Tafel and Impedance studies, as well as additional methods, were employed to monitor and record the surface, structural, and electrochemical characteristics of the deposits and bath. The reports of the study gave interesting results, which clearly the effect of chelators on additives in the nano deposition of copper in an electroless deposition bath.

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Influence of Complexing Agents on Morphologies and Mechanical Properties of Nanoporous Copper/Nickel

Cited by 2 publications

References 19 publications

Electrodeposition of Paramagnetic Copper Film under Magnetic Field on Paramagnetic Aluminum Alloy Substrates

Electrodeposition of Paramagnetic Copper Film under Magnetic Field on Paramagnetic Aluminum Alloy Substrates

The effect of chelators on additives in the surface characterization and electrochemical properties of an eco-friendly electroless copper nano deposition

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