2015
DOI: 10.1007/s00707-015-1329-z
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Influence of concentrated loading on opening of an interface crack between piezoelectric materials in a compressive field

Abstract: A plane problem for an electrically permeable tunnel crack between two piezoelectric half-spaces under concentrated loading applied to the crack faces and remote mixed-mode loading is studied. The elastic displacement and potential jumps as well as the stresses and electrical displacement along the interface are represented via sectionally holomorphic vector functions. At the crack tip, we assume closed crack faces with frictionless contact at the crack tip. The problem is reduced to combined Dirichlet-Riemann… Show more

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Cited by 9 publications
(3 citation statements)
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“…In a recent study [22], the possibility of forming a large contact zone for the example of one crack under the action of compressive or compressive-shear loading was considered. A similar problem, with the addition of concentrated loading, was investigated by Govorukha et al [23].…”
Section: Introductionmentioning
confidence: 93%
“…In a recent study [22], the possibility of forming a large contact zone for the example of one crack under the action of compressive or compressive-shear loading was considered. A similar problem, with the addition of concentrated loading, was investigated by Govorukha et al [23].…”
Section: Introductionmentioning
confidence: 93%
“…A modified capacitance model has been developed to observe the C-V characteristics of PZT thin films [25]. The interface crack between the piezoelectric materials in a compressive field is studied, to understand the reliability of these materials [26]. The effects of scaling, surface energy, and electrical boundary conditions on the formation of polarization patterns in tetragonal ferroelectrics has been studied [27].…”
Section: Introductionmentioning
confidence: 99%
“…A mathematical body of the theory of functions of a com plex variable is widely used for constructing solutions of boundary value problems of theory of plastic deformation [12], fracture mechanics for piezoelectric solids [13,14], pi ezoceramic solids [15], and bimaterials [16] with interfacial cracks under the action of mechanical loads, electromagnetic and thermal fields [17,18].…”
mentioning
confidence: 99%