Influence of copper nanoparticle film processing temperature on their structure and electrical properties

Abstract

This work is devoted to the study of the influence of the additional processing at 100, 200 and 300 • C on the morphology, microrelief, elemental composition of the surface and the electrophysical properties of glass/ITO/copper nanoparticle film structures. Studies have shown that with an increase in the processing temperature of the investigating samples reduces the amount of organic matter protecting the copper particles from oxidation. The conductivity of copper nanoparticles increases. The morphology of the surface and the elemental composition of the samples were studied by scanning electron microscopy. The microrelief of the surface and the measurement of the copper nanoparticles current-voltage characteristics were carried out using a scanning probe microscope in atomic force and scanning tunneling microscopy modes.

Modification of nanoscale thermal oxide films formed on indium phosphide under the influence of tin dioxide

“…The deposition of metals such as Mo and Ni on the ITO structure can improve the mechanical properties and increase its corrosion resistance [13], while the deposition of copper-based conductive pastes on the ITO surface can increase the lifetime of electronic devices [14].…”