Influence of Cu and Sn content in the corrosion of AISI 304 and 316 stainless steels in H2SO4

Pardo, Á.; Merino, M.C.; Carboneras, M.; Viejo, F.; Arrabal, R.; Muñoz, J.A.

doi:10.1016/j.corsci.2005.05.002

Cited by 113 publications

(58 citation statements)

References 10 publications

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“…The first step undoubtedly involves SnO or Sn(OH) 2 (black in color) but from the available thermodynamic data it was not possible to distinguish between the two reactions. In the second step oxidation to Sn(OH) 4 take place which remains stable, until it probably breaks down into metastannic acid just prior to the commencement of oxygen evolution. The proposed mechanism may be …”

Section: Figure (4): Steady State Potential Of Sn Electrode As a Funcmentioning

confidence: 99%

“…In low concentrations, the current increased smoothly by increasing potential to the limiting current corresponding to the passive region. With respect to (H + ) and (SO 4 --) ions, it was suggested that (SO 4 --) ion participated in the tin dissolution reaction. …”

Section: Potentiodynamic Polarization Measurements Potentiodynamic Bementioning

confidence: 99%

“…Primary passivity of tin is attained in NaOH solutions when the metal is covered with a film of Sn(OH) 2 or SnO. Permanent passivity sets in when Sn(OH) 4 forms as a continuous layer on the electrode surface (25,26) . The pitting sensitivity of tin in a synthetic medium similar to industrial water was not affected by pH variation (27) .…”

Section: Introductionmentioning

confidence: 99%

“…From the above reactions, it can be concluded that the tin dissolution in sulphuric acid occurs through the participation of both OH¯ and SO 4 2-ions through an intermediate of (SnHSO 4 OH) species (34) . Table 1 illustrated the electrochemical parameters calculated from Tafel relations in sulphuric acid solutions.…”

mentioning

confidence: 99%

“…Two further reactions may take place within the potential range of the first peak; one yielding dehydration of Sn(OH) 2 Dehydration of the thermodynamically unstable Sn(OH) 4 to the corresponding stable SnO 2 can occur on the tin electrode during the potential sweep to positive direction (30) . When the surface is covered with the passive film, the dissolution current falls to a small value, denoting the onset of permanent passivity.…”

mentioning

confidence: 99%

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Open-Circuit and Potentiodynamic Study on the Electrochemical Behavior of Tin Electrode in Sulphuric Acid and Sodium Hydroxide Solutions

Shahba

Ahmed

Attia

et al. 2008

Al-Azhar Bulletin of Science

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The electrochemical behavior of tin electrode in H 2 SO 4 and NaOH solutions is studied in details using open-circuit potential measurements and potentiodynamic polarization techniques. The identification of the elements present in the surface of specimen after immersion in the two test solutions is performed using an energy dispersive X-ray analysis (EDX).Open-circuit potential measurements show that for tin electrode in low concentrations of H 2 SO 4 and NaOH solutions the passivity was increased with dilution. At higher concentrations, dissolution of the pre-immersion oxide film occurs in which the corrosivety of NaOH is higher than that of H 2 SO 4 solutions. Passivation of tin in NaOH solutions appears to take place in two steps. The first involves formation of SnO or Sn(OH) 2 , in the second step oxidation to Sn(OH) 4 takes place.Potentiodynamic polarization techniques illustrate that the dissolution of tin in sulphuric acid occurs through the participation of both OH¯ and SO 4 2-ions through an intermediate of (SnHSO 4 OH) species. The potentiodynamic curves for tin in sodium hydroxide solutions exhibits an active/passive transition. The active dissolution region involves two anodic peaks prior to permanent passivity. The first anodic peak is due to the formation of Sn(OH) 2 while the second peak corresponded to the formation of Sn(OH) 4 in addition to the formation of the soluble stannate ions. Dehydration of unstable Sn(OH) 4 to the stable SnO 2 can occur on the tin electrode during the potential sweep to positive direction. Increasing concentrations of H 2 SO 4 and NaOH solutions led to enhance the corrosion current (i corr. ), and corrosion potentials (E corr ) shift towards more negative values. EDX analysis showed that Sn % present on the surface of tin electrode in 1M of each of NaOH and H 2 SO 4 solutions was 91.82 and 83.52 respectively.

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Section: Figure (4): Steady State Potential Of Sn Electrode As a Funcmentioning

confidence: 99%

Section: Potentiodynamic Polarization Measurements Potentiodynamic Bementioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

mentioning

confidence: 99%

mentioning

confidence: 99%

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Open-Circuit and Potentiodynamic Study on the Electrochemical Behavior of Tin Electrode in Sulphuric Acid and Sodium Hydroxide Solutions

Shahba

Ahmed

Attia

et al. 2008

Al-Azhar Bulletin of Science

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Crystallographic effects in corrosion of austenitic stainless steel 316L

Lindell

Pettersson

2014

Materials & Corrosion

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Electron backscatter diffraction and confocal laser microscopy have been used to quantify the degree of crystallographic anisotropy during corrosion of AISI 316L in two test solutions. Corrosion in 30 vol% H 2 SO 4 sulphuric acid shows pronounced crystallographic anisotropy in which the corrosion rate increases in the order {111} < {110} 9 {100}. The ratio between the slowest corroding {111} and the fasting corroding {100} surfaces is about 3. Pitting corrosion in a solution of FeCl 3 and AlCl 3 in ethanol/glycerol agrees with other reported observations that high-atomic density surfaces {111} and {100} are less prone to pit nucleation, however the effect was relative small.

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Effects of Ti addition on microstructure and the associated corrosion behavior of a 22Cr‐5Ni duplex stainless steel

Zhang

Chou

2021

Materials & Corrosion

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The effects of Ti addition on microstructure and the associated electrochemical properties of 22Cr-5Ni duplex stainless steel were evaluated using X-ray diffraction, X-ray electron probe microanalysis, electron backscattered diffraction, scanning Kelvin probe force microscopy, scanning electron microscopy-energy-dispersive X-ray spectroscopy, electrochemical techniques, and X-ray photoelectron spectroscopy. The results indicated that the addition of a minor amount of Ti refined the grains, improved the pitting potential, and lowered passive current densities remarkably. However, excessive content could cause an imbalance of phase proportion of ferrite and austenite phases and precipitation of the coarse TiN particles. The films on the base and Ti-containing alloy have a similar chemical composition, but the addition of Ti enriched the chromium in the passive film. In particular, the ratio of Cr 2 O 3 and Mo 6+ increased, which helped to form a comparatively homogeneous and stable passive film on the duplex stainless steel.

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Influence of Cu and Sn content in the corrosion of AISI 304 and 316 stainless steels in H2SO4

Cited by 113 publications

References 10 publications

Open-Circuit and Potentiodynamic Study on the Electrochemical Behavior of Tin Electrode in Sulphuric Acid and Sodium Hydroxide Solutions

Open-Circuit and Potentiodynamic Study on the Electrochemical Behavior of Tin Electrode in Sulphuric Acid and Sodium Hydroxide Solutions

Crystallographic effects in corrosion of austenitic stainless steel 316L

Effects of Ti addition on microstructure and the associated corrosion behavior of a 22Cr‐5Ni duplex stainless steel

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