2000
DOI: 10.1002/1096-9918(200008)30:1<597::aid-sia827>3.0.co;2-k
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Influence of depth resolution on interdiffusion measurements in polycrystalline Cu/Pd multilayers

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Cited by 5 publications
(2 citation statements)
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“…Various work on this topic [45][46][47][48][49][50] has shown that significant interdiffusion can occur in Pd-Cu thin films fabricated using deposition techniques such as electrodeposition, thermal evaporation and magnetron sputtering. Bukaluk [50] reports interdiffusion between Pd/Cu multilayers occurring at temperatures as low as 120 °C.…”
Section: Eqmentioning
confidence: 92%
“…Various work on this topic [45][46][47][48][49][50] has shown that significant interdiffusion can occur in Pd-Cu thin films fabricated using deposition techniques such as electrodeposition, thermal evaporation and magnetron sputtering. Bukaluk [50] reports interdiffusion between Pd/Cu multilayers occurring at temperatures as low as 120 °C.…”
Section: Eqmentioning
confidence: 92%
“…The Cu-Pd system, which is of considerable interest in catalytic applications [17][18][19], has been chosen for this study due to its relatively simple phase diagram. The difference between the lattice constants of Cu and Pd (7%) should lead to considerable stress development upon interdiffusion.…”
Section: Introductionmentioning
confidence: 99%