Investigation of interdiffusion and depth resolution in Cu/Ni multilayers by means of AES depth profiling

Yan, X. L.; Liu, Y.; Swart, H.C.; Wang, J.Y.; Terblans, J.J.

doi:10.1016/j.apsusc.2015.12.151

Cited by 14 publications

(2 citation statements)

References 28 publications

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“…In turn, AES examinations showed that annealing Cu/Ni multilayers (325-375°C for 30 min.) caused a mutual diffusion of the components only at the interface closest to the silicon substrate [42].…”

Section: Introductionmentioning

confidence: 99%

The Temperature Stability of Nanometric Multilayers of Copper and Chromium–Nickel Steel (Cu/310S)

Kucharska

Olejnik²

2019

Int J Thermophys

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Multilayers consisted of Cu and AISI 310S steel fabricated on a Si(100) monocrystalline silicon substrate by the magnetron sputtering method were investigated. The multilayers were differentiated by the number of periods (50, 100 and 150) and by the thickness of 310S steel sublayer (2 nm and 4 nm), while maintaining a constant thickness of the Cu (2 nm). The temperature stability tests were performed in an air atmosphere by isothermal annealing in the temperature range from 23°C to 400°C. It was found that the temperature stability of Cu/310S steel multilayers depends on their thickness. The thickest multilayers show stability up to a temperature of 375°C. Thinner multilayers exhibit stability up to a higher temperature of 400°C, in spite of their thermal expansion coefficients being greater.

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Section: Introductionmentioning

confidence: 99%

The Temperature Stability of Nanometric Multilayers of Copper and Chromium–Nickel Steel (Cu/310S)

Kucharska

Olejnik²

2019

Int J Thermophys

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“…Epitaxial growth of magnetic thin films enables the precise control of strain and crystal orientation, both of which have critical effects on the magnetization of thin films . Another important benefit of epitaxial growth is limiting the grain boundary diffusion, which is shown to play a critical role in interlayer diffusion of the multilayer ultrathin films . In order to fully realize the benefits of the ultrathin magnetic films, they need to be grown in an epitaxial fashion with a fine‐tuned crystal structure and orientation.…”

Section: Introductionmentioning

confidence: 99%

In Situ Synchrotron X‐Ray Diffraction Analysis of Phase Transformation in Epitaxial Metastable hcp Nickel Thin Films, Prepared via Plasma‐Enhanced Atomic Layer Deposition

Motamedi

Bosnick

Cadien

et al. 2018

Adv Materials Inter

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thickness and the crystal structure are necessary requirements. [15,16] Epitaxial growth of magnetic thin films enables the precise control of strain and crystal orientation, both of which have critical effects on the magnetization of thin films. [17,18] Another important benefit of epitaxial growth is limiting the grain boundary diffusion, which is shown to play a critical role in interlayer diffusion of the multilayer ultrathin films. [19,20] In order to fully realize the benefits of the ultrathin magnetic films, they need to be grown in an epitaxial fashion with a fine-tuned crystal structure and orientation. This subject is explored in the present paper.Plasma-enhanced atomic layer deposition (PEALD) is a method for the deposition of Ni films that offers several advantages over more mainstream deposition methods, such as sputtering and chemical vapor deposition (CVD). These advantages include precise thickness control, relatively low growth temperature, and conformality, i.e., the ability to deposit a film with a uniform thickness over a non-flat substrate. [21][22][23] All of these benefits make this method suitable for growing ultrathin films, where thickness and structure are critical parameters. [24] The authors have previously reported the plasma-enhanced ALD growth and characterization of nickel thin films with quasi-epitaxial crystal structure. [25] As reported, increasing the deposition temperature resulted in improving the crystallinity of the films. At deposition temperature of 360 °C, chemically pure nickel films were deposited. Crystal structure analysis showed the films had a polycrystalline textured structure with a strong out-of-plane orientation relationship with the sapphire substrate. However, full epitaxial growth was not achieved. This issue has been addressed in this paper.Apart from the above-mentioned publication, there have been other recent reports on nickel deposition. Park et al. [26] recently reported on PEALD of nickel thin films using [Ni(dpdab) 2 ] and NH 3 plasma, with the films reportedly having a fcc polycrystalline structure. In a separate study, Suturin et al. [27] demonstrated the deposition of epitaxial nickel islands on CaF 2 at 600 °C, using an electron beam source. The isolated islands had fcc crystal structure and crystallographic orientations dictated by that of the substrate. On a related subject, Tarachand et al. [28] investigated phase structure and magnetism in nickel nanoparticles grown by thermal decomposition, and reported that the Ultrathin metal films have a wide variety of applications, especially in microelectronics. A key method to deposit these films is plasma-enhanced atomic layer deposition (PEALD), which is known for its ability to deposit thin films conformally and at relatively low temperatures. Building on the recent work, an improved recipe is reported on for the development of nickel PEALD technology, through which fully epitaxial nickel thin films are deposited. The effect of continuous heating on the phase structure and agglomeration in the met...

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Quantitative evaluation of sputtering induced surface roughness and its influence on AES depth profiles of polycrystalline Ni/Cu multilayer thin films

Yan

Coetsee

Wang

et al. 2017

Applied Surface Science

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Investigation of interdiffusion and depth resolution in Cu/Ni multilayers by means of AES depth profiling

Cited by 14 publications

References 28 publications

The Temperature Stability of Nanometric Multilayers of Copper and Chromium–Nickel Steel (Cu/310S)

The Temperature Stability of Nanometric Multilayers of Copper and Chromium–Nickel Steel (Cu/310S)

In Situ Synchrotron X‐Ray Diffraction Analysis of Phase Transformation in Epitaxial Metastable hcp Nickel Thin Films, Prepared via Plasma‐Enhanced Atomic Layer Deposition

Quantitative evaluation of sputtering induced surface roughness and its influence on AES depth profiles of polycrystalline Ni/Cu multilayer thin films

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