Influence of diamond particle size on the thermal and mechanical properties of glass-diamond composites

Feng, Dandan; Li, Zhihong; Zhu, Yumei; Ji, Huanli

doi:10.1016/j.mseb.2017.10.017

Cited by 19 publications

(6 citation statements)

References 20 publications

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Section: Electronic Substratementioning

confidence: 99%

“…The challenges in thermal management limit the LTCC technology in applications involving higher packing density and high power density. Hence, the incorporation of active dielectric material with higher phonon conduction (like diamond [219], alumina [220,221]) are expected to result better properties. Coprecipitation or addition of cordierite [222] or anorthite [216] improves the dielectric properties of the glass-based LTCC, whereas the addition of alumina improves both dielectric property and thermal conductivity.…”

Section: Other Applicationsmentioning

confidence: 99%

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Lithium aluminosilicate (LAS) glass-ceramics: a review of recent progress

Venkateswaran

Sreemoolanadhan

Vaish

2021

International Materials Reviews

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The lithium aluminosilicate system (LAS) is being explored for almost seven decades due to its anomalous and attractive properties (especially low/negative thermal expansion and fast ion conduction) and its commercial significance in consumer as well as strategic sectors. This review introduces current commercial applications of LAS systems, necessary background science, structural features of different LAS crystal systems, including their polymorphs and solid-solutions, and the origin of unusual properties. Significant emphasis is provided on processing transparent, nanocrystalline, low thermal expansion glass-ceramic (LEGC), the role of chemical constituents and additives, the effect of heat-treatment, and microstructural evolution while processing LEGC. Detailed discussions are provided on the following areas: LAS matrix composites, chemical strengthening of glass and glass-ceramic, low temperature co-fired ceramics (LTCC) and associated joining technologies (hydrolysis catalysis bonding, anodic bonding, brazing, etc.) that would further extend the application portfolio of LAS system.

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Section: Electronic Substratementioning

confidence: 99%

Section: Other Applicationsmentioning

confidence: 99%

Lithium aluminosilicate (LAS) glass-ceramics: a review of recent progress

Venkateswaran

Sreemoolanadhan

Vaish

2021

International Materials Reviews

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“…Microstructural manipulations such as filler particle re-orientation, low thermal conductivity, secondary phase removal, and grain boundary control are also explored. Among them, some of key research works are summarized in Table 6 [33,[45][46][47][48][49][50][51][52][53].…”

Section: Glass-ceramic Base Ltcc Systemmentioning

confidence: 99%

“…Glass-ceramics filled with 3-40 μm size monocrystal diamond particles were studied, and the results showed highest thermal conductivity at the glass-diamond composites with 30 μm size diamonds that sintered at 750°C and revealed the lowest CTE, the highest thermal conductivity and bending strength: 4.35 ppm/°C, 9.01 W/mK, and 108.25 MPa [51] (Figure 18).…”

Section: Glass-ceramic Base Ltcc Systemmentioning

confidence: 99%

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High Thermal Conductivity Ceramics and Their Composites for Thermal Management of Integrated Electronic Packaging

Kim¹

2018

Heat Transfer - Models, Methods and Applications

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Recently, ceramic substrates have been of great interest for use in light emitting diode (LED) packaging materials because of their excellent heat transfer capability. The thermal conductivities of ceramic-based substrates are usually one or two orders of magnitude higher than those of conventional epoxy-based substrates. The demand for ceramic substrates with high mechanical strength and thermal conductivity is also growing due to their use in thin and high-power device packaging substrates. Examples are direct bonded copper or aluminum or direct plated copper substrates for insulated gate bipolar transistors; thin and robust ceramic packages for image sensor modules that are used in mobile smart phones; ceramic packages for miniaturized chip-type supercapacitors; and high-power LED packages. This chapter will cover the development and application of ceramics and ceramic composites with high thermal conductivity for the thermal management of integrated electronic packaging substrates such as high-power LED packaging, power device packaging, etc.

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