Influence of External Interface Normal Stress on the Growth of Cu–Sn IMC During Aging

Wang, Changchang; Chen, Yinbo; Liu, Zhiquan

doi:10.1007/s40195-020-01059-3

Cited by 6 publications

(3 citation statements)

References 18 publications

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“…However, the area of flaky Birich phase increased with the extension of time. It is generally considered that Bi-rich phase could undergo thermal expansion under high-temperature aging [1,26], so that the Bi-rich phase in Sn-Bi-Ag solder joints would gradually coarsen during the high-temperature stage of thermal cycling test. This phenomenon in the present investigation had already appeared when the thermal cycling test reached 150 cycles (see Fig.…”

Section: Experiments Proceduresmentioning

confidence: 99%

“…Traditional eutectic Sn42-Bi58 solder alloy has a melting point of 138 °C, and has been widely used in consumer electronic products compared with SAC305 solder due to its lower cost [1][2][3][4]. The wetting angle of Sn-Bi solder on Cu substrate is larger than that of Sn63-Pb37 alloy, indicating that Sn-Bi eutectic solder has a good wettability during reflow [5].…”

Section: Introductionmentioning

confidence: 99%

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Microstructural evolution and failure analysis of Sn–Bi57–Ag0.7 solder joints during thermal cycling

Chen

Wang

Gao

et al. 2021

J Mater Sci: Mater Electron

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Although many studies have reported the behaviors of thermal cycling of Snbased solder joints, the corresponding mechanism is difficult to describe universally due to the complexity of different cases. In the present study, microstructural evolution and failure of Sn-Bi57-Ag0.7 solder joints caused by thermal cycling between -40 and 85 °C from 0 to 1000 cycles were systematically investigated. The results indicated that the Sn-Bi-Ag solder joint was composed of Sn-rich phase, Bi-rich phase, large numbers of Bi dispersed-particles, and Ag 3 Sn precipitate. With the extension of time during thermal cycling, the microstructure of Sn-Bi-Ag solder joint gradually coarsened and the IMC layer became thicker (from 0.82 to 2.38 lm). However, Sn-Bi-Ag solder joints failed after 3000 thermal cycles. Two different stages of failure were found and the mechanism, related to the increment of thermal mismatch stress, was illuminated. Furthermore, Electron Backscattered Diffraction was used to detailedly elucidate the grain characteristics of the failed Sn-Bi-Ag solder joints, and the effect of thermal stress on orientations of Sn and Bi grains was also revealed. Being different from the orientation change observed in traditional Sn-Bi eutectic solder joints in previous studies, the present results demonstrated that both Sn and Bi grains did not present any preferred orientations after thermal cycling. And the reason of this phenomenon might be attributed to the Ag 3 Sn, which could be regarded as second-phase particles. Our present work would provide theoretical guidance for the development of new Sn-Bi-X solders with high reliabilities.

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Section: Experiments Proceduresmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Microstructural evolution and failure analysis of Sn–Bi57–Ag0.7 solder joints during thermal cycling

Chen

Wang

Gao

et al. 2021

J Mater Sci: Mater Electron

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“…[14,15] Aside from the atomic diffusion rate, stress is also contributed to the IMC evolution. [16,17] Cu 6 Sn 5 includes hexagonal η-Cu 6 Sn 5 phase and monoclinic η'-Cu 6 Sn 5 phase; [18] and the η-Cu 6 Sn 5 will transform into η'-Cu 6 Sn 5 at 186 ℃, which generates a 2% volume expansion introducing considerable stress in the IMC layer [19,20] to promote the evolution from Cu 6 Sn 5 to porous Cu 3 Sn. Hence, research on the phase transition stability of η-Cu 6 Sn 5 is another essential aspect about the formation of porous Cu 3 Sn.…”

Section: Introductionmentioning

confidence: 99%

Inhibiting effects of the Ni barrier layer on the growth of porous Cu3Sn in 10-μm microbumps

Liu

Yang

Ling

et al. 2021

J Mater Sci: Mater Electron

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With the shrinkage of size, porous Cu 3 Sn have become a new potential threat of the reliability in micron Cu pillar bump. The formation of porous Cu 3 Sn is contributed the decomposition of Cu 6 Sn 5 , which is caused by the overgrowth of intermetallic compounds (IMC) and the stress introduced by the phase transition of Cu 6 Sn 5 . In this paper, uniform Ф10 µm Cu/Sn and Cu/Ni (~0.6 μm)/Sn microbumps have been fabricated by multilayer electrodeposition and the effect of the Ni layer on the growth behavior of porous Cu 3 Sn was investigated by comparing the evolution of IMC in Cu/Sn and Cu/Ni/Sn bumps aged at 170 ℃ and 200 ℃. The ~0.6 μm Ni layer can effectively retard the Cu atoms diffusion, which can hinder IMC from overgrowth. Moreover, with the help of X-ray diffraction (XRD), the ability of the Ni layer in stabilizing Cu 6 Sn 5 phase is strengthened, which weakens the tendency of the porous Cu 3 Sn formation.Under the conjoint action of retarding the growth of IMC and stabilizing Cu 6 Sn 5 phase, the Ni layer can inhibit the formation of porous Cu 3 Sn e caciously.

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Role of Cu microstructure during isothermal aging of Cu/Sn/Cu micro solder joints

Wei,

Zhang,

Shi

et al. 2024

J Mater Sci

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Influence of External Interface Normal Stress on the Growth of Cu–Sn IMC During Aging

Cited by 6 publications

References 18 publications

Microstructural evolution and failure analysis of Sn–Bi57–Ag0.7 solder joints during thermal cycling

Microstructural evolution and failure analysis of Sn–Bi57–Ag0.7 solder joints during thermal cycling

Inhibiting effects of the Ni barrier layer on the growth of porous Cu3Sn in 10-μm microbumps

Role of Cu microstructure during isothermal aging of Cu/Sn/Cu micro solder joints

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