2019
DOI: 10.5324/nordis.v0i26.3277
|View full text |Cite
|
Sign up to set email alerts
|

Influence of Field Grading in Setup for Electric Breakdown Testing of Polyethylene Films

Abstract: High dielectric strength of solid electrical insulation materials for high voltage applications is essential for high reliability and long-term performance.The IEC 60243 and ASTM D149 both describe very similar test methods to determine the short-term electric strength of solid insulation materials. A test sample, usually thin plaque, is placed in an electrode system with surrounding insulating oil. The voltage is then steadily increased until an electric breakdown occurs. Despite the relatively simple test se… Show more

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
2

Citation Types

0
2
0

Year Published

2023
2023
2023
2023

Publication Types

Select...
1

Relationship

0
1

Authors

Journals

citations
Cited by 1 publication
(2 citation statements)
references
References 3 publications
0
2
0
Order By: Relevance
“…This has, indeed, been recently reported by Li et al and by Andersson et al in crosslinked polyethylene (XLPE) and low-density polyethylene (LDPE), respectively, for other applications. [27,28] To illustrate the reduced fringing due to encapsulation, Figure 3 shows the variation in the E-field enhancement factor 𝜂 calculated at an electroplated Au electrode edge (5 μm thick and 0.5 μm radius of curvature) as a function of the PI insulating film thickness in the case where the encapsulation is either an insulating oil or a subsequent PI capping overlayer. The enhancement factor 𝜂 increases monotonically with the PI insulating film thickness.…”
Section: State-of-the-art Of Polyimide Breakdown Field Versus Thickne...mentioning
confidence: 99%
See 1 more Smart Citation
“…This has, indeed, been recently reported by Li et al and by Andersson et al in crosslinked polyethylene (XLPE) and low-density polyethylene (LDPE), respectively, for other applications. [27,28] To illustrate the reduced fringing due to encapsulation, Figure 3 shows the variation in the E-field enhancement factor 𝜂 calculated at an electroplated Au electrode edge (5 μm thick and 0.5 μm radius of curvature) as a function of the PI insulating film thickness in the case where the encapsulation is either an insulating oil or a subsequent PI capping overlayer. The enhancement factor 𝜂 increases monotonically with the PI insulating film thickness.…”
Section: State-of-the-art Of Polyimide Breakdown Field Versus Thickne...mentioning
confidence: 99%
“…This has, indeed, been recently reported by Li et al and by Andersson et al in crosslinked polyethylene (XLPE) and low‐density polyethylene (LDPE), respectively, for other applications. [ 27,28 ]…”
Section: State‐of‐the‐art Of Polyimide Breakdown Field Versus Thickne...mentioning
confidence: 99%