Influence of gallium addition in Sn–Ag–Cu lead-fee solder

Chen, Huiming; Guo, Chengjun; Huang, Jiapeng; Wang, Hang

doi:10.1007/s10854-015-3102-4

Cited by 8 publications

(3 citation statements)

References 13 publications

(16 reference statements)

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“…Also, small addition of gallium to the Ag‐Cu‐Sn lead‐free solder were introduced to lower the melting points and change the wettability of this solder. [ 9 ] Unfortunately, many important technical challenges need to be addressed before they can be successfully applied to solder. The mechanical behavior and reliability of Ag‐Cu‐Ga solder joints may be significantly controlled by these two IMCs (Ag 2 Ga and CuGa 2 ).…”

Section: Introductionmentioning

confidence: 99%

Structural, Electronic, and Mechanical Properties of Ag‐Cu‐Ga Intermetallic Compounds: First‐Principles Calculations

Xu,

Liu,

Zhou

2023

Cryst. Res. Technol.

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In this paper, the mechanical properties, electronic structures, and thermodynamic properties of Ag2Ga and CuGa2 under pressure are studied using the first‐principles method based on Density functional theory (DFT). With the increase in pressure, the equilibrium lattice constants (a/a0 and c/c0) and volume ratio (V/V0) of Ag2Ga and CuGa2 continuously decrease. The elastic constants show that Ag2Ga and CuGa2 are mechanically stable under pressures of 0–20 GPa, and the increase in pressure improves their deformation resistance. The results of Young's modulus (E) show that the hardness of CuGa2 is higher than that of Ag2Ga. The results of Cauchy pressure (C12 ‐ C44) and B/G ratio show that the plasticity of Ag2Ga and CuGa2 can be maintained with the increase in pressure. By analyzing the density of states (DOS), charge density difference (CDD), and population, the influence of pressure on electronic structure is studied. The calculated Debye temperature (θD) shows that the covalent bond of CuGa2 is stronger.

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Section: Introductionmentioning

confidence: 99%

Structural, Electronic, and Mechanical Properties of Ag‐Cu‐Ga Intermetallic Compounds: First‐Principles Calculations

Xu,

Liu,

Zhou

2023

Cryst. Res. Technol.

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“…[3,4] Also, small additions of gallium to the Ag-Cu-Sn lead-free solder were introduced to lower the melting points and to change wettability of this solder. [5] As far as solid gallium alloys are concerned, it was found that gallium addition to gold results in bright-blue color, which is exploited in jewelry. [6][7][8] Addition of gallium into gold-palladium and copper-palladium alloys led to the production of a new type of fillings in dentistry.…”

Section: Introductionmentioning

confidence: 99%

Experimental Investigations of Phase Equilibria in Ternary Ag-Cu-Ga System

Jendrzejczyk-Handzlik

Handzlik

Fitzner

2018

J. Phase Equilib. Diffus.

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Experimental study of phase equilibria in the ternary Ag-Cu-Ga system was carried out by using DTA/ DSC, isothermal equilibration and microscopic as well as x-ray analyses. DTA experiments were conducted for alloys, whose concentrations varied along two cross-sections determined by the ratio of mole fractions x Ag /x Cu-= 1:1 and x Ag /x Ga = 1:1. Equilibration of samples was carried out at 200, 450 and 650°C. The obtained information about phases in equilibrium was compared with the results of calculations of the phase diagram for conditions identical to our experiments. It was demonstrated that the results of calculations are compatible with the experimental data.

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“…The Ga atoms dissolved into the melting solder matrix which eventually caused the spreading ratio to increase. Higher content of Ga in the solders (above 2wt%) resulted in change of lattice parameters of solders and substrates, increasing the coherency of interface (Chen, Guo, Huang & Wang, 2015).…”

Section: On the Wettability Of Sn-ga Soldersmentioning

confidence: 99%

Microstructure Control of Sn-based Alloys for Lead-free Solder as Microelectronic Interconnect Application

Mazlan¹

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Use of leaded solder was an issue in human health a few years back, while lead-free solders developed recently possesses higher melting temperature than conventional leaded solders. Thus, further research to develop more Sn-based solders with low-eutectic temperatures as compared to existing alloys are required. In this study, the effects of Gallium addition to five Sn-based alloys (Sn, SAC, Sn100C, Sn100CV, Sn-0.7Cu) at three different concentrations (0wt%Ga, 0.1wt%Ga and 2.0wt%Ga) was investigated. The microstructures of these alloys and the nature of their interactions with substrates including Electroless Nickel Immersion Gold (ENIG) and Organic Solderability Preservative (OSP) finishes is discussed.Thermal Analysis was done to investigate the resulting nucleation temperature of each alloy. The Sn-based alloys with 2.0wt% Ga additions had a reduction of 2℃-7℃ in growth temperatures when compared to their solidus temperatures. This matches the prediction from Sn-Ga phase diagram from previous studies. The intermetallic layers that formed between the solder and substrate showed that 0.1wt% Gallium resulted in a reaction with both Copper OSP and Nickel ENIG substrates, but higher concentrations of Ga (2.0wt%) did not result in a reaction at the interface. The microstructure analysis also showed that cracks formed in the cast specimens containing Ga and the solder balls appeared to have poorer wettability with increased Ga content. Both results suggested that there is segregation of Ga due to its low melting point, inducing low melting phase during solidification.In conclusion, the results indicate there is a critical composition of Ga which produces a homogeneous reaction with the alloys to assist in the fabrication of solder balls. Further studies on the properties of Ga containing alloys are required to fully understand the commercial potential.

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Influence of gallium addition in Sn–Ag–Cu lead-fee solder

Cited by 8 publications

References 13 publications

Structural, Electronic, and Mechanical Properties of Ag‐Cu‐Ga Intermetallic Compounds: First‐Principles Calculations

Structural, Electronic, and Mechanical Properties of Ag‐Cu‐Ga Intermetallic Compounds: First‐Principles Calculations

Experimental Investigations of Phase Equilibria in Ternary Ag-Cu-Ga System

Microstructure Control of Sn-based Alloys for Lead-free Solder as Microelectronic Interconnect Application

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