Influence of heavily doped connecting layers on the sensitivity of pressure sensors

Li, Ting; Shang, Haiping; Xiao, Bo; Wang, Weibing

doi:10.1016/j.sna.2022.113493

Cited by 2 publications

(1 citation statement)

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“…The existence of a HDCR would reduce the sensitivity of a pressure sensor, and the reduction is proportional to the ratio of its resistance to the total resistance of the piezoresistor. Three different prototypes were manufactured and tested by Li et al to highlight the impact of HDCRs, in which the length of the HDCR was significantly larger than that of the LDPR [ 64 ]. The experimental results showed that an 18% decrease in sensitivity would happen if the form of the HDCR was not designed correctly.…”

Section: Structural Engineering In Piezoresistorsmentioning

confidence: 99%

Structural Engineering in Piezoresistive Micropressure Sensors: A Focused Review

Liu¹,

Jiang

Yang³

et al. 2023

Micromachines

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The longstanding demands for micropressure detection in commercial and industrial applications have led to the rapid development of relevant sensors. As a type of long-term favored device based on microelectromechanical system technology, the piezoresistive micropressure sensor has become a powerful measuring platform owing to its simple operational principle, favorable sensitivity and accuracy, mature fabrication, and low cost. Structural engineering in the sensing diaphragm and piezoresistor serves as a core issue in the construction of the micropressure sensor and undertakes the task of promoting the overall performance for the device. This paper focuses on the representative structural engineering in the development of the piezoresistive micropressure sensor, largely concerning the trade-off between measurement sensitivity and nonlinearity. Functional elements on the top and bottom layers of the diaphragm are summarized, and the influences of the shapes and arrangements of the piezoresistors are also discussed. The addition of new materials endows the research with possible solutions for applications in harsh environments. A prediction for future tends is presented, including emerging advances in materials science and micromachining techniques that will help the sensor become a stronger participant for the upcoming sensor epoch.

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Section: Structural Engineering In Piezoresistorsmentioning

confidence: 99%