Influence of interfacial delamination on channel cracking of elastic thin films

Mei, Haixia; Pang, Yaoyu; Huang, Rui

doi:10.1007/s10704-008-9205-7

Cited by 55 publications

(32 citation statements)

References 29 publications

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“…While the energy release rate for the Cu/BCB interface is consistently lower than that of the Cu/Si interface, the energy release rate for the Si/BCB interface is surprisingly high at the limit of short cracks. As shown in a previous study [27], the asymptotic behavior for the energy release rate of a short interfacial crack depends on the elastic mismatch of the two materials. Previous measurements have reported several interfacial fracture energies [28], which are 12.2 J/m 2 for the Cu/BCB interface and over 24 J/m 2 for the Si/BCB interface.…”

Section: B Effects Of Dielectric Buffer Layersupporting

confidence: 63%

Impact of Near-Surface Thermal Stresses on Interfacial Reliability of Through-Silicon Vias for 3-D Interconnects

Ryu

Lu²,

Zhang

et al. 2011

IEEE Trans. Device Mater. Relib.

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247

102

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Abstract-Continual scaling of on-chip wiring structures has brought significant challenges for materials and processes beyond the 32-nm technology node in microelectronics. Recently, 3-D integration with through-silicon vias (TSVs) has emerged as an effective solution to meet the future interconnect requirement. Among others, thermomechanical reliability is a key concern for the development of TSV structures used in die stacking as 3-D interconnects. This paper examines the effects of thermally induced stresses on the interfacial reliability of TSV structures. First, 3-D distribution of the thermal stress near the TSV and the wafer surface is analyzed. Using a linear superposition method, a semianalytic solution is developed for a simplified structure consisting of a single TSV embedded in a silicon (Si) wafer. The solution is verified for relatively thick wafers by comparing to numerical results from finite element analysis (FEA). The stress analysis suggests interfacial delamination as a potential failure mechanism for the TSV structure. An analytical solution is then obtained for the steady-state energy release rate as the upper bound for the interfacial fracture driving force, while the effect of crack length is evaluated numerically by FEA. With these results, the effects of the TSV dimensions (e.g., via diameter and wafer thickness) on the interfacial reliability are elucidated. Furthermore, the effects of via material properties and dielectric buffer layers are discussed.

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Section: B Effects Of Dielectric Buffer Layersupporting

confidence: 63%

Impact of Near-Surface Thermal Stresses on Interfacial Reliability of Through-Silicon Vias for 3-D Interconnects

Ryu

Lu²,

Zhang

et al. 2011

IEEE Trans. Device Mater. Relib.

Self Cite

247

102

View full text Add to dashboard Cite

show abstract

“…In the FEA model, the intrinsic edge warping/curling was idealised as a uniaxial edge-stress condition such that the induced cohesive interfacial stresses were assumed developing hypothetically along a 2D debonded edges rather than on the entire slab interface. In this respect, a 2-D plane strain analysis would suffice (Houben, 2003;Mei et al, 2007). Edge warping/curling was induced using the corresponding edge curvature estimated for variable overlay thickness of 50, 75, 100 and 125mm.…”

Section: Numerical Analysis and Simulationsmentioning

confidence: 99%

Investigation of intrinsic de-bonding in bonded concrete overlays: Material characterisation and numerical Study

Olubanwo¹,

Karadelis²,

Saïdani³

et al. 2018

10.5267/j.esm

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This study investigates the evolution of intrinsic interfacial de-bonding of Roller Compacted Steel Fibre Reinforced Polymer Modified Concrete (RC-SFR-PMC) bonded on substrate Ordinary Portland Cement Concrete (OPCC), using both experimental and numerical techniques. The relative effects of evolving material inhomogeneity and composite dimensional stability during curing was studied as a function of overlay structural scale, using a 2D plane strain Interface Cohesive Zone Model (ICZM). The effects of creep coefficient on interface restraint capacity and ensuing cohesive zone length were clearly evaluated. The results showed that the applied curvature due to the measured shrinkage strain was inadequate to cause critical de-bonding. In the FEA results, while the rate of interface energy release generally varies as a function of the bi-material relative stiffness and overlay structural scale, it is also evident that the two variables lose effects as the overlay structural scale approaches 0.50. The overall indicative trend shows that the rate of energy release in compliant overlay when relative stiffness( α<0) is higher than when α>0. Therefore, a more compliant overlay typically exhibits less relative restraint to bending induced de-bonding.

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“…7(d). Generally, the steady-state energy release rate of the failure mode can be unified as [57,61,67]:…”

Section: Cracking Modes Of Epitaxial Splatsmentioning

confidence: 99%

Epitaxial growth and cracking of highly tough 7YSZ splats by thermal spray technology

Chen

Yang

2017

J Adv Ceram

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Thermally sprayed coatings are essentially layered materials and contain large numbers of lamellar pores. It is thus quite necessary to clarify the formation mechanism of lamellar pores which significantly influence coating performances. In the present study, to elaborate the formation mechanism of lamellar pores, the yttria-stabilized zirconia (ZrO 2 -7 wt% Y 2 O 3 , 7YSZ) splats, which have high fracture toughness and tetragonal phase stability, were employed. Interestingly, anomalous epitaxial growth occurred for all deposition temperatures in spite of the extremely high cooling rate, which clearly indicated chemical bonding and complete contact at splat/substrate interface before splat cooling. However, transverse spallation substantially occurred for all deposition temperatures in spite of the high fracture toughness of 7YSZ, which revealed that the lamellar pores were from transverse cracking/spallation due to the large stress during splat cooling. Additionally, fracture mechanics analysis was carried out, and it was found that the stress arose from the constraint effect of the shrinkage of the splat by locally heated substrate with the value about 1.97 GPa. This clearly demonstrated that the stress was indeed large enough to drive transverse cracking/spallation forming lamellar pores during splat cooling. All of these contribute to understanding the essential features of lamellar bonding and further tailoring the coating structures and performance.

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Influence of interfacial delamination on channel cracking of elastic thin films

Cited by 55 publications

References 29 publications

Impact of Near-Surface Thermal Stresses on Interfacial Reliability of Through-Silicon Vias for 3-D Interconnects

Impact of Near-Surface Thermal Stresses on Interfacial Reliability of Through-Silicon Vias for 3-D Interconnects

Investigation of intrinsic de-bonding in bonded concrete overlays: Material characterisation and numerical Study

Epitaxial growth and cracking of highly tough 7YSZ splats by thermal spray technology

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