Influence of LaNiO3 bottom electrode on the structural and physical properties of ferroelectric capacitors

Epitaxial 0.65PbMg1/3Nb2/3O3–0.35PbTiO3 (PMN–PT) thin films grown on LaNiO3/CeO2/YSZ buffered Si substrates

“…Little success has been achieved in obtaining high quality epitaxial perovskite PMN-PT films on a conductive electrode due to the appearance of stable pyrochlore phases. To achieve oriented, or even epitaxial films, the PMN-PT films are prepared on single crystal substrates, such as SrTiO 3 [3], Al 2 O 3 [4], and LaAlO 3 [5], that posses a crystal structure and lattice constants that approximate those of PMN-PT. However, single-crystal substrates are expensive and can only provide a small-sized geometry, which is contrary to Si technology that features lower cost, a larger area, and volume production.…”

Epitaxial PMN–PT thin films grown on buffered Si substrates using ceramic and single-crystal targets

“…Although researchers have already obtained good epitaxial PMN-PT thin films on some single crystal substrates such as SrTiO 3 [6], Al 2 O 3 [7], and LaAlO 3 [8] using different deposition methods (sputtering, pulsed laser deposition, and metal-organic chemicalvapor deposition), fabrication on silicon is preferred for industrial applications, because it is a much cheaper substrate and also provides the promise that it can be integrated with a complementary metal-oxide semiconductor process. In order to grow epitaxial PMN-PT thin films on an Si substrate, suitable buffer layers with good diffusion barrier properties and Si epitaxy must be used.…”

Effect of ZnO whisker content on sinterability and fracture behaviour of PZT peizoelectric composites

“…On the other hand, PZT ceramics have been extensively modified with different additives, which make them more attractive for specific applications [8][9][10][11][12][13][14]. With the miniaturization and integration of electronic circuits, small-scale piezoelectric devices are technologically important in the fields of smart materials and microelectromechanical systems (MEMS) [15].…”