Influence of Low Thermal Budget Plasma Oxidation and Millisecond Laser Anneal on Gate Stack Reliability in view of 3D Sequential Integration

Lu, Chieh-Hsun; Fenouillet-Béranger, C.; Gassilloud, R.; Graoui, H.; Larmagnac, D.; Sharma, Shashank; Garros, X.; Leroux, C.; Toffoli, A.; Romano, G.; Kies, R.; Rambal, N.; Samson, M-P.; Prévitali, B.; Guedj, C.; Bernier, Nicolas; Kerdilès, S.; Brunet, Laurent; Batude, P.; Skotnicki, T.; Vinet, Maud

doi:10.7567/ssdm.2016.ps-1-06

Extended Abstracts of the 2016 International Conference on Solid State Devices and Materials 2016

DOI: 10.7567/ssdm.2016.ps-1-06

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Influence of Low Thermal Budget Plasma Oxidation and Millisecond Laser Anneal on Gate Stack Reliability in view of 3D Sequential Integration

Chieh-Hsun Lu¹,

C. Fenouillet-Béranger²,

R. Gassilloud³

et al.

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Influence of Low Thermal Budget Plasma Oxidation and Millisecond Laser Anneal on Gate Stack Reliability in view of 3D Sequential Integration

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