Influence of megasonic agitation on the electrodeposition of high aspect ratio blind vias

Kaufmann, Jens Georg; Desmulliez, Marc Phillipe Yves; Price, Dennis; Hughes, Michael S.; Strussevich, N.; Bailey, C.

doi:10.1109/estc.2008.4684530

Cited by 3 publications

(2 citation statements)

References 6 publications

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“…This reduction, in turn, increases the limited current density, which enables a larger, more efficient plating reaction. For MS frequencies, the layer is reduced further compared to US, enabling access to higher limited current densities (Kaufmann et al , 2011).…”

Section: Introductionmentioning

confidence: 99%

Morphology and acoustic artefacts of copper deposits electroplated using megasonic assisted agitation

Jones¹,

Flynn²,

Desmulliez³

et al. 2016

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Purpose ± A study of the influence of megasonic (MS) assisted agitation on Printed Circuit Boards (PCBs) electroplated using copper electrolyte solutions, to improve plating efficiencies through enhanced ion transportation. Design/methodology/approach-The impact of MS assisted agitation on topographical properties of the electroplated surfaces studied, through a Design of Experiments (DOE), by measuring surface roughness, characterised by values of the parameter Ra as measured by white light phase shifting interferometry and high resolution scanning electron microscopy. Findings ± An increase of Ra from 400 nm to 760 nm measured after plating, for an increase to acoustic power from 45 W to 450 W. Roughening increase due to micro-bubble cavitation energy, supported through direct imaging of the cavitation. Current thieving effect by the MS transducer induced low-currents, leading to large Cu grain frosting reducing the board quality. Current thieving was negated in plating trials through specific placement of transducer. Wavy electroplated surfaces, due to surface acoustic waves, also observed reducing the uniformity of the deposit. Research limitations/implications ± The formation of unstable transient cavitation and variation of the topology of the copper surface are unwanted phenomena. Further plating studies using megasonic agitation are needed, along with fundamental simulations, to determine how the effects can be reduced or prevented. Practical implications ± Identify manufacturing settings required for high-quality MS assisted plating and promote areas for further investigation, leading to the development of an MS plating manufacturing technique. Originality/value ± Quantification of the topographical changes to a PCB surface in response to megasonic agitation and evidence for deposited copper artefacts due to acoustic effects.

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Section: Introductionmentioning

confidence: 99%

Morphology and acoustic artefacts of copper deposits electroplated using megasonic assisted agitation

Jones¹,

Flynn²,

Desmulliez³

et al. 2016

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“…Unlike the situation for a blanket film (e.g., surface Cu), the blind holes possess a U-shaped structure, where the plating current distribution is nonuniform upon electrodeposition because of the current crowding effect. [33][34][35] Furthermore, the distribution of the electrolyte as well as organic additives depends on the geometric pattern (flow field) and the plating current density, 11,13,[36][37][38] which may play a key role in the Cu self-annealing behavior. The objective of this study was to investigate the self-annealing behavior of electroplated Cu in the BH structure, specifically focusing on the crystallographic miz E-mail: ceho1975@hotmail.com crostructure evolution and impurity redistribution in the as-deposited stage.…”

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confidence: 99%

Self-Annealing Behavior of Electroplated Cu in Blind-Hole Structures

Yang

Lee

et al. 2019

J. Electrochem. Soc.

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Blind-hole (BH) metallization via Cu electrodeposition is a critical technology for printed circuit boards (PCBs) with high-density interconnections (HDIs) because it provides excellent thermal and electrical conductivity and efficient space utilization. In this study, the self-annealing behavior of electroplated Cu was in-situ characterized via ohmmeter measurements, field-emission scanning electron microscopy (FE-SEM) in combination with electron backscatter diffraction (EBSD) analysis, and time-of-flight secondary ion mass spectrometry (TOF-SIMS). A strong correlation among the electrical property transition, Cu crystallographic transition, and impurity distribution was established that supports the curvature enhanced accelerator coverage (CEAC) mechanism and advances our understanding of the Cu physical/chemical characteristics in BH structures.

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Megasound acoustic surface treatment process in the Printed Circuit Board industry

Jones

Flynn

Desmulliez

2016

2016 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP)

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Influence of megasonic agitation on the electrodeposition of high aspect ratio blind vias

Cited by 3 publications

References 6 publications

Morphology and acoustic artefacts of copper deposits electroplated using megasonic assisted agitation

Morphology and acoustic artefacts of copper deposits electroplated using megasonic assisted agitation

Self-Annealing Behavior of Electroplated Cu in Blind-Hole Structures

Megasound acoustic surface treatment process in the Printed Circuit Board industry

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