As a kind of important strategic resource, molybdenum
(Mo) and
its alloys are widely applied in solar cells and 5G radio frequency
filters. In order to improve the yield of industrial production, it
is important to reduce the nonuniformity of thin-film thickness. We
prepared Mo films on CMOS compatible Si/SiO2 wafers through
a magnetron sputtering method and systematically investigated the
effect of tuning of several process parameters on film thickness nonuniformity
and other structural properties, including crystallite size (D), microstrain (ε), and dislocation density (δ).
At optimized sputtering power (80 W), chamber pressure (0.4 Pa), argon
flow rate (90 sccm), substrate temperature (350 °C), and target–substrate
distance (9 cm), the deposited 200 nm-thick Mo films show a unified
<110> preferred orientation, and the film thickness nonuniformity
reaches an excellent value of 0.46%, with a surface roughness of 0.83
nm and the full width at half maximum (FWHM) of X-ray diffraction
(XRD) (110) rocking curve as low as 0.47°. Our results provide
efficient reference for the preparation of uniform metal films, which
have potential for improving the quality and yield in filter device
manufacturing.