Influence of N-N dimethyl formamide on electroless copper plating using hypophosphite as reducing agent

Anik, T.; Haloui, A.; Touhami, M. Ebn; Touir, R.; Larhzil, H.; Sfaira, M.; Mcharfi, Mohammed

doi:10.1016/j.surfcoat.2014.02.026

Cited by 12 publications

(9 citation statements)

References 27 publications

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“…The shape of the voltammogramms remained similar with and without additive. The first cathodic peak at -0.037 V/Ag/AgCl (peak B) was attributed to the copper reduction, followed by hydrogen evolution at -0.8 V/Ag/AgCl (peak C) [6]. In the anodic range, it is observed a peak (A) at 0.39 V/Ag/AgCl, associated to copper dissolution formed during cathodic scan.…”

Section: Scanning Electronic Microscopy Morphologymentioning

confidence: 96%

“…Thus, the polarization curve showed that, from -0.040 V/Ag/AgCl up to -0.40 V/Ag/AgCl, the cathodic process is under activation control, whereas from -0.40 V/Ag/AgCl to -0.80 V/Ag/AgCl, it was mass transport-controlled; and from E = -0.8 V/Ag/AgCl, it became an hydrogen evolution [22,[24][25][26]. In addition, the pale diffusion was attributed to Cu 2+ reduction, such as mentioned by Anik et al [6]. However, in the cinnamon extract addition to the electrolyte (7), the hydrogen reduction potential was shifted to more negative values, with a remarkable decrease in the cathodic current density.…”

Section: Scanning Electronic Microscopy Morphologymentioning

confidence: 99%

“…Various protection methods have been used, such as metal layers deposition. Copper electroplating has been often used in microelectronics industry [3][4][5][6]. Copper is an excellent choice as underlayment.…”

Section: Introductionmentioning

confidence: 99%

See 2 more Smart Citations

Environmental Cinnamon Extracts Effect on Electrodeposition of Copper in an Acidic Bath

Dahmani¹,

Galai²,

Elhasnaoui³

et al. 2018

Port. Electrochim. Acta

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A new industrial electrodeposition of copper in an acidic medium using an environmental cinnamon extract has been developed. The obtained coatings were adherent and uniform, and their deposition rate has reached 23 µm/h. In addition, their quality has been improved by cinnamon extract addition. Cyclic voltammetry and electrochemical impedance spectroscopy have showed that the electrodeposition mechanism depends on the electrolyte constituents and the additive presence. The SEM observation indicated that the coatings morphology has been improved by cinnamon extract addition.

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Section: Scanning Electronic Microscopy Morphologymentioning

confidence: 96%

Section: Scanning Electronic Microscopy Morphologymentioning

confidence: 99%

See 1 more Smart Citation

Environmental Cinnamon Extracts Effect on Electrodeposition of Copper in an Acidic Bath

Dahmani¹,

Galai²,

Elhasnaoui³

et al. 2018

Port. Electrochim. Acta

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show abstract

“…Thus, the solution pH is a significant factor in the electrodeposition, indeed, it affects both anodic and cathodic reactions and various phenomena correlating with the structure and composition of the metal-solution interphase. The major phenomena include; adsorption, potential zero charge, structure of the double layer, structure of ion species in the solution and the ionic strength of the solution [26]. The Figure 4b shows the deposition rate as a function of various applied current densities at different pH values.…”

Section: Deposition Ratementioning

confidence: 99%

Tin Electrodeposition from Sulfuric Acid Solution Containing Nigella Sativa Essential Oil Added

Benabida¹,

Cherkaoui²

2017

Eurasian J Anal Chem

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Experimental investigations have been performed, using cyclic and linear sweep Voltammetry, to determine the effects of Nigella sativa essential oil additive (NS) on the electrodeposition of tin on mild steel in acid sulfuric solution. The experiments were performed under different plating time, different current densities, pH and temperature conditions. Tin electrodeposition on mild steel was performed using a DC -supply at denoted operating parameters. The presence of the NS additive caused an increase of the activation energy and of the overvoltage of the reduction of hydrogen and stannous ions. The surface of the plated steel was examined using Scanning electron microscope. Different surface characteristics were obtained depending upon the presence or free-additive. The electrodeposition rate of the plated surface was also determined by a gravimetric technique. The quality of the electro-deposition of tin, in the presence of Nigella sativa, was good as indicated by the microstructural morphology of the plated surface except for the few porosities demonstrated.

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“…This antenna consists of a single hole with coaxial dimples designed by using FDTD calculation. Such an in-situ characterization approach is required for analysis of a variety of systems at the solid-liquid interface, such as electroless deposition process [8][9][10][11][12]. Meanwhile, the theoretical calculation (DFT) can provide molecular level, basic level information to support and compare with experimental analyses for better understanding the characterizations [13][14][15].…”

Section: Introductionmentioning

confidence: 99%

Novel Analysis Method for the Solid-liquid Interface Using Surface Enhanced Raman Spectroscopy

Jiang¹

2017

dtcse

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It is very important to focus on the solid-liquid interface for analysis of a variety of systems at solid-liquid interface such as electroless deposition processes. In order to avoid the influence of "bulk" solutions, we characterized reductants (i.e., hydrazine, hypophosphite, formaldehyde) adsorption on Ag surface down to the single molecular level by using plasmon antenna enhanced Raman scattering with a high-selectivity component. The concentric-patterned antenna coated with Ag, which consisted of a single hole with coaxial dimples, was designed by Finite Difference Time Domain (FDTD) calculation to enhance the electric field by focusing surface plasmon. By using this antenna and comparing the spectra to the results of Density Functional Theory (DFT) calculations, Raman peaks of adsorbed reductants on Ag were identified. These results suggest that this approach can exactly focus on the solid-liquid interface, and such in-situ characterization will be beneficial for analysis of catalytic reactions, which is one of the most difficult applications in electroless deposition processes.

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Influence of N-N dimethyl formamide on electroless copper plating using hypophosphite as reducing agent

Cited by 12 publications

References 27 publications

Environmental Cinnamon Extracts Effect on Electrodeposition of Copper in an Acidic Bath

Environmental Cinnamon Extracts Effect on Electrodeposition of Copper in an Acidic Bath

Tin Electrodeposition from Sulfuric Acid Solution Containing Nigella Sativa Essential Oil Added

Novel Analysis Method for the Solid-liquid Interface Using Surface Enhanced Raman Spectroscopy

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