Influence of nanoparticle addition on the formation and growth of intermetallic compounds (IMCs) in Cu/Sn–Ag–Cu/Cu solder joint during different thermal conditions

Tan, Ai Ting; Yusof, Farazila

doi:10.1088/1468-6996/16/3/033505

Cited by 52 publications

(24 citation statements)

References 125 publications

(235 reference statements)

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“…Formation of Cu 6 Sn 5 IMC during wetting reduces the term as given by Eq 3 : (Ref 18 ) where is the solid–liquid interface surface energy before the Cu 6 Sn 5 formation and is the Gibbs free energy per unit area for the Cu 6 Sn 5 formation ( is a negative number). As per the theory of adsorption, NPs in the molten solder gets adsorbed at the interface and increase the number of Cu 6 Sn 5 grains per unit area (Ref 19 ). In other words, NPs increases the driving force for the nucleation of Cu 6 Sn 5 phases which eventually lead to the decrease in the surface tension (Ref 20 ).…”

Section: Resultsmentioning

confidence: 99%

Ultrasonic-Assisted Dispersion of ZnO Nanoparticles to Sn-Bi Solder: A Study on Microstructure, Spreading, and Mechanical Properties

Rajendran

Kang

Jung

2021

J. of Materi Eng and Perform

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Nanocomposite Sn-Bi solders received noticeable attention for flexible electronics due to their improved mechanical properties. The main limitation is the dispersion of nanoparticles in the solder alloy. Accordingly, in this work, varying additions of ZnO nanoparticles were successfully dispersed into Sn57Bi solder via the liquid-state ultrasonic treatment. Nanocomposite solders were prepared using the melting and casting route. The solder alloys were then characterized for microstructure, spreading and mechanical properties. With increasing ZnO addition, the microstructure revealed significant refinement of Bi-and Snrich phases. Consequently, the eutectic lamellar spacing also decreases. The spreading improved up to 0.1 wt.% ZnO addition. For higher additions, nanocomposite solders experienced deterioration in spreading characteristics. The tensile strength of the solder increases with an increase in the amount of ZnO nanoparticles. High ductility is achieved for nanocomposite solder containing 0.05 wt.% ZnO. An attempt was made, to explain the effect of increasing ZnO nanoparticle addition on microstructural, spreading, and mechanical properties of Sn57Bi solder.

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Section: Resultsmentioning

confidence: 99%

Ultrasonic-Assisted Dispersion of ZnO Nanoparticles to Sn-Bi Solder: A Study on Microstructure, Spreading, and Mechanical Properties

Rajendran

Kang

Jung

2021

J. of Materi Eng and Perform

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“…This CuNiSn IMC is more thermodynamically stable than the CuSn IMC, and thus can improve the long-term reliability of electronic joints due to hinder the excessive brittle IMC layer growth. 8,14) Figure 4 shows the in situ selective concentration behavior of LMPA fillers and Ni particles for metallization region by the flow-coalescence-wetting behaviors of the filler within the formulated SPC for the line-type Cu pattern-formed wetting test coupon. The LMPAs and Ni particles were uniformly distributed within the SPC at the initial conditions (Fig.…”

Section: Resultsmentioning

confidence: 99%

Interconnection Mechanism of Ni-Reinforcement Particle Filled Solderable Polymer Composites with Low-Melting-Point Alloy Filler

et al. 2020

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A novel bonding material system and its interconnection mechanism using a Ni-reinforcement particle filled solderable polymer composites (SPCs) with a low-melting-point alloy (LMPA) filler was proposed to enhance the mechanical properties of the SPC joints. To confirm the feasibility of the proposed interconnection mechanism of Ni-reinforcement particle filled SPC, two types of wetting test (e.g., flat and line pattern wetting test) were conducted. The Ni-reinforcement particle filled SPC exhibited better wettability compared with those of SPC without Ni particle. In the microstructure inspection, ternary CuNiSn intermetallic compound (IMC) was formed at surface of the Ni particles within the LMPA region and bonding interface between Cu metallization and LMPA. Additionally, the flow, coalescence and selective wetting behaviors of molten LMPA filler was not hindered by incorporated Ni particles.

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“…Also, at this ratio, the lattice distortion ε has the highest value, and this relation is in a good agreement with the Scherrer equation. This was calculated according to the relation between the crystallite size D eff and local lattice distortion as Williamson Hall method (Ting Tan et al , 2015; Doan, 1953): where: D eff is the crystallite size, and ε is local lattice distortion in the β-Sn matrix.…”

Section: Resultsmentioning

confidence: 99%

Nickel effects on the structural and some physical properties of the eutectic Sn-Ag lead-free solder alloy

Gumaan

Shalaby

Yousef

et al. 2019

SSMT

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Purpose This study aims to investigate the structural, mechanical, thermal and electrical properties of tin–silver–nickel (Sn-Ag-Ni) melt-spun solder alloys. So, it aims to improve the mechanical properties of the eutectic tin–silver (Sn-Ag) such as tensile strength, plasticity and creep resistance by adding different concentrations of Ni content. Design/methodology/approach Ternary melt-spun Sn-Ag-Ni alloys were investigated using x-ray diffractions, scanning electron microscope, dynamic resonance technique (DRT), Instron machine, Vickers hardness tester and differential scanning calorimetry. Findings The results revealed that the Ni additions 0.1, 0.3, 0.5, 0.7, 1, 3 and 5 Wt.% to the eutectic Sn-Ag melt-spun solder were added. The “0.3wt.%” of Ni was significantly improved its mechanical properties to efficiently serve under high strain rate applications. Moreover, the uniform distribution of Ag3Sn intermetallic compound with “0.3wt.%” of Ni offered the potential benefits, such as high strength, good plasticity consequently and good mechanical performance through a lack of dislocations and microvoids. The tensile results showed improvement in 17.63 per cent tensile strength (26 MPa), 21 per cent toughness (1001 J/m3), 22.83 per cent critical shear stress (25.074 MPa) and 11 per cent thermal diffusivity (2.065 × 10−7 m2/s) when compared with the tensile strength (21.416 MPa), toughness (790 J/m3), critical shear stress (19.348 MPa) and thermal diffusivity (1.487 × 10−7 m2/s) of the eutectic Sn-Ag. Slight increments have been shown for the melting temperature of Sn96.2-Ag3.5-Ni0.3 (222.62°C) and electrical resistivity to (1.612 × 10−7 Ω.m). It can be said that the eutectic Sn-Ag solder alloy has been mechanically improved with “0.3wt.%” of Ni to become a suitable alloy for high strain rate applications. The dislocation movement deformation mechanism (n = 4.5) without Ni additions changed to grain boundary sliding deformation mechanism (n = 3.5) with Ni additions. On the other hand, the elastic modulus, creep rate and strain rate sensitivity with “0.3wt.%” of Ni have been decreased. The optimum Ni-doped concentration is “0.7wt.%” of Ni in terms of refined microstructure, electrical resistivity, Young’s Modulus, bulk modulus, shear modulus, thermal diffusivity, maximum shear stress, tensile strength and average creep rate. Originality/value This study provides nickel effects on the structural of the eutectic Sn-Ag rapidly solidified by melt-spinning technique. In this paper, the authors have compared the elastic modulus of the melt-spun compositions which has been resulted from the tensile strength tester with these results from the DRT for the first time to best of the authors’ knowledge. This paper presents new improvements in mechanical and electrical performance.

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Influence of nanoparticle addition on the formation and growth of intermetallic compounds (IMCs) in Cu/Sn–Ag–Cu/Cu solder joint during different thermal conditions

Cited by 52 publications

References 125 publications

Ultrasonic-Assisted Dispersion of ZnO Nanoparticles to Sn-Bi Solder: A Study on Microstructure, Spreading, and Mechanical Properties

Ultrasonic-Assisted Dispersion of ZnO Nanoparticles to Sn-Bi Solder: A Study on Microstructure, Spreading, and Mechanical Properties

Interconnection Mechanism of Ni-Reinforcement Particle Filled Solderable Polymer Composites with Low-Melting-Point Alloy Filler

Nickel effects on the structural and some physical properties of the eutectic Sn-Ag lead-free solder alloy

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