Influence of oxygen and oxidant on corrosion inhibition of cysteine self-assembled membranes for copper

Zhang, Da Quan; Zeng, Hui jing; Zhang, Li; Liu, Peihui; Gao, Lin

doi:10.1016/j.colsurfa.2014.01.017

Cited by 19 publications

(4 citation statements)

References 37 publications

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“…This high absolute value indicated the strong adsorption ability between DMP and copper surface. 65,66 These results further proved that the adsorption of DMP on copper surface increased cathodic potential and charge transfer resistance, inhibited the copper surface electrodeposition, and increased lling performance of microvia. This result is similar to Janus Green B, which was an effective leveler proved by several scholars.…”

Section: Molecular Dynamic Simulationmentioning

confidence: 71%

4,6-Dimethyl-2-mercaptopyrimidine as a potential leveler for microvia filling with electroplating copper

et al. 2017

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Section: Molecular Dynamic Simulationmentioning

confidence: 71%

4,6-Dimethyl-2-mercaptopyrimidine as a potential leveler for microvia filling with electroplating copper

et al. 2017

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“…76 In other words, (ii) the copper clusters would be maintained stable and react with dissolved oxygen or OH À in the solution. 77,78 Simulations based on DFT were carried out to study the combination of atomic oxygen and OH À with copper clusters, and the results are plotted in Fig. 9.…”

Section: Paper Pccpmentioning

confidence: 99%

Nanostructured copper/copper oxide hybrids: combined experimental and theoretical studies

Geng

2016

Phys. Chem. Chem. Phys.

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With the extensive study of dealloying, copper oxides have been shown to be important members and exhibit huge potential in catalysis, energy transformation and storage fields. In this work, nanostructured copper/copper oxide hybrids were prepared through dealloying the sintered Al85Cu15 alloy and molecular dynamics (MD) simulations as well as calculations based on density functional theory (DFT) were performed to explore the oxidation mechanisms of copper in aqueous electrolytes. Cu/Cu2O/CuO compositions were obtained after immersing the sintered alloys in 20 wt% NaOH solutions under corrosion-free conditions at room temperature. Both X-ray diffraction (XRD) and potentiodynamic polarization results reveal that there exist large differences between the sintered Al85Cu15 alloy and its counterpart cast alloy and the Rietveld simulation analysis as well as MD simulations testify to the inhomogeneous atom distribution in the sintered alloy. DFT studies show that Cun (1 ≤n≤ 9) clusters possess higher surface energies than the Cu(111) surface and the calculated binding energies of the copper clusters and an atomic oxygen (Cun-O) are much higher than that of Cu(111)-O. The low surface diffusivity (Ds) of the clusters at the alloy-electrolyte interface extends their diffusion time, which may be beneficial to the formation and growth of oxide nuclei precursors during the dealloying process. Their microstructures and morphologies characterized by scanning electron microscopy (SEM) and transmission electron microscopy (TEM) show that CuO exists in the form of a nanoplate while Cu2O is a nanoparticle. Nanoporous copper (NPC) obtained by dealloying sintered and cast alloys exists in the form of a bicontinuous ligament-channel structure. This work enriches the dealloying research from both experimental and theoretical aspects.

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“…18 A high E binding indicates the strong adsorption capacity between PBDGE and copper surface. 42,43 The electrostatic effect between PBDGE and copper surface governs the competitive adsorption of additives. PBDGE's adsorption results in a reduction in the area of copper exposed from the cathode, which affects the copper electrodeposition.…”

Section: ■ Results and Discussionmentioning

confidence: 99%

Copolymer of Pyrrole and 1,4-Butanediol Diglycidyl as an Efficient Additive Leveler for Through-Hole Copper Electroplating

Zhou

Yan

et al. 2020

ACS Omega

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A copolymer comprising of pyrrole and 1,4-butanediol diglycidyl ether (PBDGE) was designed and synthesized as a leveler to improve the throwing power for printed circuit board (PCB) through-hole electroplating. The results of linear sweep voltammetry (LSV), galvanostatic measurements (GMs), and cyclic voltammetry (CV) reveal the strong coordination effect of PBDGE with other additives and confirm the advantageous performance of PBDGE to effectively assist the electroplating of through-hole. An increment of 35.5% in the throwing power was achieved under the addition of PBDGE in through-hole plating. Additionally, the reaction mechanism was studied by quantum chemical calculations and molecular dynamics (MD) simulations, indicating that the pyrrole rings of the PBDGE molecule are adsorbed on the copper surface as the adsorption sites to balance the copper plating regardless of the through-hole position differences.

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Influence of oxygen and oxidant on corrosion inhibition of cysteine self-assembled membranes for copper

Cited by 19 publications

References 37 publications

4,6-Dimethyl-2-mercaptopyrimidine as a potential leveler for microvia filling with electroplating copper

4,6-Dimethyl-2-mercaptopyrimidine as a potential leveler for microvia filling with electroplating copper

Nanostructured copper/copper oxide hybrids: combined experimental and theoretical studies

Copolymer of Pyrrole and 1,4-Butanediol Diglycidyl as an Efficient Additive Leveler for Through-Hole Copper Electroplating

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