Influence of preheat and maximum temperature of the solder-reflow profile on moisture sensitive IC's

Abstract

The purpose of this work was to determine the influence of preheat and maximum solder reflow temperature on the level of moisture induced damage in plastic surface mount integrated circuits. Both an analytical moisture diffusion model and Finite Element Modeling were applied to the analysis of absorption/desorption behavior of plastic molding compounds. The models were used to analyze the moisture ingress kinetics during controlled environmental exposures and for the prediction of moisture desorption characteristics during solder reflow conditions. Moisture/reflow experiments were conducted on an 80-pin PQFP, 225-pin PBGA's, and two TSQP's (a 56-pin and a 40-pin). Devices were evaluated using C-mode Scanning Acoustic Microscopy. Effects of maximum reflow temperature on measured damage response were determined showing that as a rule the JEDEUIPC moisture resistance drops by one level for every 20°C increase in maximum reflow temperature. The overall benefit of extended preheat is shown to be beneficial for only thin packages that are not saturated. Details of the method used for predicting the beneficial effects of preheating are described.0-7803-3857-X/97 $4.00 01997 IEEE 1041 lectronic ~~m~o n~n~~ and Technology C o n f~~e n~e

On the mode II popcorn effect in thin packages

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Heel Crack and Lead-Free Soldering Issues Affecting Power Electronics Packages

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Product-specific 'moisture levels': a conceptual framework

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