Influence of probe dynamic characteristics on the scanning speed for white light interference based AFM

Yang, Wenjun; Liu, Xiaojun; Lu, Wenlong; Guo, Xiaoting

doi:10.1016/j.precisioneng.2017.09.005

Cited by 24 publications

(7 citation statements)

References 24 publications

Supporting

Mentioning

Contrasting

Unclassified

Order By: Relevance

“…The plunge cutting produced a taper groove as shown in Figure 8, which was measured using a white light interferometer [36,37]. Distinct difference between ductile-cut and brittle-cut surfaces can be observed.…”

Section: Experimental Validationmentioning

confidence: 99%

Mechanism of Unstable Material Removal Modes in Micro Cutting of Silicon Carbide

2019

View full text Add to dashboard Cite

This study conducts large-scale molecular dynamics (MD) simulations of micro cutting of single crystal 6H silicon carbide (SiC) with up to 19 million atoms to investigate the mechanism of unstable material removal modes within the transitional range of undeformed chip thickness in which either brittle or ductile mode of cutting might occur. Under this transitional range, cracks are always formed in the cutting zone, but the stress states cannot guarantee their propagation. The cutting mode is brittle when the cracks can propagate and otherwise ductile mode cutting happens. Plunge cutting experiment is conducted to produce a taper groove on a 6H SiC wafer. There is a transitional zone between the brittle-cut and ductile-cut regions, which has a mostly smooth surface with a few brittle craters on it. This study contributes to the understanding of the detailed process of brittle-ductile cutting mode transition (BDCMT) as it shows that a transitional range can occur even for single crystals without internal defects and provides guidance for the determination of tcritical from taper grooves made by various techniques, e.g., to adopt larger tcritical around the end of the transitional range to increase machining efficiency for grinding or turning as long as the cracks do not extend below the machined surface.

show abstract

Section: Experimental Validationmentioning

confidence: 99%

Mechanism of Unstable Material Removal Modes in Micro Cutting of Silicon Carbide

2019

View full text Add to dashboard Cite

show abstract

“…However, it needs much iteration in dealing with parameter identification of industrial robots since there are more than 20 dimensions in the optimization model. BPNN can improve the convergence ability of PSO [17,18]. Inspired by this fact, this paper proposes a kinematic parameteridentification method based on BPNN-PSO, which can greatly improve the convergence speed of the PSO algorithm.…”

Section: Introductionmentioning

confidence: 99%

Hybrid Optimal Kinematic Parameter Identification for an Industrial Robot Based on BPNN‐PSO

et al. 2018

View full text Add to dashboard Cite

A novel hybrid algorithm that employs BP neural network (BPNN) and particle swarm optimization (PSO) algorithm is proposed for the kinematic parameter identification of industrial robots with an enhanced convergence response. The error model of the industrial robot is established based on a modified Denavit-Hartenberg method and Jacobian matrix. Then, the kinematic parameter identification of the industrial robot is transformed to a nonlinear optimization in which the unknown kinematic parameters are taken as optimal variables. A hybrid algorithm based on a BPNN and the PSO is applied to search for the optimal variables which are used to compensate for the error of the kinematic parameters and improve the positioning accuracy of the industrial robot. Simulations and experiments based on a realistic industrial robot are all provided to validate the efficacy of the proposed hybrid identification algorithm. The results show that the proposed parameter-identification method based on the BPNN and PSO has fewer iterations and faster convergence speed than the standard PSO algorithm.

show abstract

“…Commercially available surface profile measurement instruments, such as scanning electron microscopes (SEMs), optical profilers, and atomic force microscopes (AFMs), encounter unsolvable difficulties in the surface profile measurement of microstructures [15][16][17][18][19][20][21]. For instance, SEMs can carry out fast measurements with a high horizontal resolution of up to nanometers [17,18,22].…”

Section: Introductionmentioning

confidence: 99%

“…During the measurement of microstructures with a slope of 45-90°, the measurement result has large errors in the area with a sharp surface slope because of the effect of light reflection. On the other hand, AFMs have extremely high spatial resolutions both in the horizontal and vertical directions and are usually employed for imaging nanoscale surfaces [19][20][21]25]. However, its measurement ranges in the horizontal and vertical directions are limited to several microns, and therefore, it cannot effectively measure the surface profiles of microstructures with sizes ranging from several microns to several hundred microns.…”

Section: Introductionmentioning

confidence: 99%

Surface Profile Measurement and Error Compensation of Triangular Microstructures Employing a Stylus Scanning System

Yin

et al. 2018

Journal of Nanomaterials

View full text Add to dashboard Cite

Microstructure-based function components are widely used in precision engineering. Surface profile measurement is an essential tool to verify the manufacturing quality of microstructures and to enhance the working performance of the device employing microstructures as function components. However, highly accurate surface profile measurements are difficult to perform for microstructures owing to their complex surface topographies. In this paper, a measurement system is proposed for the surface profile measurement of microstructures. The main components of the measurement system are a precision displacement stage to move the workpiece, a homemade probing system with a diamond microstylus to sense the surface profile variation of the microstructures on the workpiece, and a vibration isolation table to reduce the disturbance of the measurement environment. In addition, the stability of the measurement was experimentally investigated. Microstructures with shape of equilateral right triangle were employed as the measurement specimen, and the surface profile of triangular microstructures was measured by employing two methods to correct errors caused by the specimen inclination and the radius of the stylus tip. The shape, depth, and period of the measured microstructures were also detected based on the results of the surface profile measurement. Experimental results demonstrate the feasibility of the proposed surface profile measurement for microstructures with complex surface topographies.

show abstract

Influence of probe dynamic characteristics on the scanning speed for white light interference based AFM

Cited by 24 publications

References 24 publications

Mechanism of Unstable Material Removal Modes in Micro Cutting of Silicon Carbide

Mechanism of Unstable Material Removal Modes in Micro Cutting of Silicon Carbide

Hybrid Optimal Kinematic Parameter Identification for an Industrial Robot Based on BPNN‐PSO

Surface Profile Measurement and Error Compensation of Triangular Microstructures Employing a Stylus Scanning System

Contact Info

Product

Resources

About