Influence of steering magnetic field on the time-resolved plasma chemistry in cathodic arc discharges

Ehiasarian, Arutiun P.; Hovsepian, P.Eh.; New, R.; Valter, J.

doi:10.1088/0022-3727/37/15/008

Cited by 12 publications

(7 citation statements)

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“…where Vo and A are system dependent constants [113,114]. The voltage may be higher when external magnetic fields that restrict the flow of electrons are present [115][116][117].…”

Section: Filtered Cathodic Arc Depositionmentioning

confidence: 99%

“…Even small pressures of inert (Ar, [117,132,133]) or reactive (N2 [134,135], O2 [136]) gas result in dramatic loss of highly charged states -typically 3 + and higher, due to charge exchange with the working gas [134,137] or three-body recombination at pressures exceeding the 1 mTorr range [137].…”

Section: Filtered Cathodic Arc Depositionmentioning

confidence: 99%

“…The magnetic field may influence the CSD and especially the ionization of the gas. For magnetic fields parallel to the cathode surface (planar magnetron type), the CSD is decreased due to recombination of metal ions from the cathode spot with free electrons from a residual working gas plasma confined near the cathode along the entire race track [117]. This situation is often encountered in industrial production units using steered cathodic arc for deposition processes.…”

Section: Filtered Cathodic Arc Depositionmentioning

confidence: 99%

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Ionized physical vapor deposition (IPVD): A review of technology and applications

et al. 2006

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In plasma-based deposition processing, the importance of low-energy ion bombardment during thin film growth can hardly be exaggerated. Ion bombardment is an important physical tool available to materials scientists in the design of new materials and new structures. Glow discharges and in particular the magnetron sputtering discharge have the advantage that the ions of the discharge are abundantly available to the deposition process. However, the ion chemistry is usually dominated by the ions of the inert sputtering gas while ions of the sputtered material are rare. Over the past few years, various ionized sputtering techniques have appeared that can achieve a high degree of ionization of the sputtered atoms, often up to 50 % but in some cases as much as approximately 90%. This opens a complete new perspective in the engineering and design of new thin film materials. The development and application of magnetron sputtering systems for ionized physical vapor deposition (IPVD) is reviewed. The application of a secondary discharge, inductively coupled plasma

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“…where Vo and A are system dependent constants [113,114]. The voltage may be higher when external magnetic fields that restrict the flow of electrons are present [115][116][117].…”

Section: Filtered Cathodic Arc Depositionmentioning

confidence: 99%

Section: Filtered Cathodic Arc Depositionmentioning

confidence: 99%

Section: Filtered Cathodic Arc Depositionmentioning

confidence: 99%

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Ionized physical vapor deposition (IPVD): A review of technology and applications

et al. 2006

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“…The shift to higher charge states by a magnetic field has been extensively documented in the literature [79][80][81][82][83][84][85][86][87]. The strength of the magnetic field is in most cases not sufficient to "magnetize" ions: only the electrons are magnetized.…”

Section: Effects Of the Magnetic Field On Plasma Expansion And Ion Chmentioning

confidence: 99%

The evolution of ion charge states in cathodic vacuum arc plasmas: a review

Anders¹

2012

Plasma Sources Sci. Technol.

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ACKNOWLEDGMENTMany of the here-collected results are based on ideas and contributions by close friends and colleagues. Running the risk of offending those not mentioned, I gratefully acknowledge the input over the years from just a few: B. Jüttner, E. Hantzsche, P. Siemroth, T. Schülke, I. Brown, E. Oks and G. Yushkov. This work was supported by the U.S. Department of Energy under Contract No. DE-AC02-05CH11231. DISCLAIMERThis document was prepared as an account of work sponsored by the United States Government. While this document is believed to contain correct information, neither the United States Government nor any agency thereof, nor The Regents of the University of California, nor any of their employees, makes any warranty, express or implied, or assumes any legal responsibility for the accuracy, completeness, or usefulness of any information, apparatus, product, or process disclosed, or represents that its use would not infringe privately owned rights. Reference herein to any specific commercial product, process, or service by its trade name, trademark, manufacturer, or otherwise, does not necessarily constitute or imply its endorsement, recommendation, or favoring by the United States Government or any agency thereof, or The Regents of the University of California. The views and opinions of authors expressed herein do not necessarily state or reflect those of the United States Government or any agency thereof or The Regents of the University of California. 2The evolution of ion charge states in cathodic vacuum arc plasmas: a review André AndersLawrence Berkeley National Laboratory, 1 Cyclotron Road, MS 53, Berkeley, California 94720, USA Email: aanders@lbl.gov AbstractCathodic vacuum arc plasmas are known to contain multiply charged ions. 20 years after "Pressure Ionization: its role in metal vapour vacuum arc plasmas and ion sources" appeared in vol. 1 of Plasma Sources Science and Technology, it is a great opportunity to re-visit the issue of pressure ionization, a non-ideal plasma effect, and put it in perspective to the many other factors that influence observable charge state distributions, such as the role of the cathode material, the path in the density-temperature phase diagram, the "noise" in vacuum arc plasma as described by a fractal model approach, the effects of external magnetic fields and charge exchange collisions with neutrals. A much more complex image of the vacuum arc plasma emerges putting decades of experimentation and modeling in perspective.

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“…For a magnetic field of 15 mT, the speed of movement is 10-15 m s À1 (21). As the Ampere force bends the plasma column to the direction of j 3 B, the spot moves counterintuitively in the opposite direction.…”

Section: Rapid Sequence Of Microexplosionsmentioning

confidence: 99%

Cathodic-Arc and Thermal-Evaporation Deposition

Koskinen

2014

Comprehensive Materials Processing

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Influence of steering magnetic field on the time-resolved plasma chemistry in cathodic arc discharges

Cited by 12 publications

References 11 publications

Ionized physical vapor deposition (IPVD): A review of technology and applications

Ionized physical vapor deposition (IPVD): A review of technology and applications

The evolution of ion charge states in cathodic vacuum arc plasmas: a review

Cathodic-Arc and Thermal-Evaporation Deposition

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