2010
DOI: 10.1016/j.jcrysgro.2010.02.010
|View full text |Cite
|
Sign up to set email alerts
|

Influence of substrate temperature on the shape of GaAs nanowires grown by Au-assisted MOVPE

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
3
1
1

Citation Types

0
5
0

Year Published

2012
2012
2019
2019

Publication Types

Select...
7
1

Relationship

0
8

Authors

Journals

citations
Cited by 12 publications
(5 citation statements)
references
References 37 publications
0
5
0
Order By: Relevance
“…Therefore, they could be incorporated into the NW sidewalls after diffusion processes. It should be stressed that a similar effect has been already observed during the growth of GaAs NWs at relatively high temperatures [37]. Finally, it does not rule out the possibility that the small-diameter segments on the GaAs/Si interface could exist originally and could later manifest themselves during the long-time annealing.…”
Section: Resultsmentioning
confidence: 84%
“…Therefore, they could be incorporated into the NW sidewalls after diffusion processes. It should be stressed that a similar effect has been already observed during the growth of GaAs NWs at relatively high temperatures [37]. Finally, it does not rule out the possibility that the small-diameter segments on the GaAs/Si interface could exist originally and could later manifest themselves during the long-time annealing.…”
Section: Resultsmentioning
confidence: 84%
“…The observed decrease of the growth rate toward lower temperatures can be attributed only to low cracking efficiencies of TMGa at low temperatures. For the latter, we use the temperature depend ence of [97]:…”
Section: Regular Growth Model In the Stationary Casementioning
confidence: 99%
“…This results in a dramatic decrease of the size of the produced devices and significant simplification of the fabrication process. Silicon NWs can be produced via the VLS technique by chemical vapor deposition, , electron-beam evaporation, molecular beam epitaxy, magnetron sputtering, and pulsed laser deposition , (PLD). Among these technologies, PLD is the most flexible one in terms of plasma energy range (10–100 eV) and growth speeds.…”
Section: Introductionmentioning
confidence: 99%