Influence of the Bond Foot Angle on Active Power Cycling Lifetime of Wire Bonds

Sippel, Marcel; Tan, Yi Fong; Schmidt, Ralf; Botazzoli, P.; Sprenger, Mario; Franke, Jörg

doi:10.1109/eurosime56861.2023.10100802

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Influence of the Bond Foot Angle on Active Power Cycling Lifetime of Wire Bonds

Cited by 4 publications

References 9 publications

A Conceptional Study towards Developing a Novel Copper Top-Side Interconnection Process in Power Electronics using Additive Manufacturing

A Conceptional Study towards Developing a Novel Copper Top-Side Interconnection Process in Power Electronics using Additive Manufacturing

Influence of Geometry Effects on Thermo-Mechanical Reliability of Aluminum Bond Wires in Discrete SiC MOSFETs

Comparative Study on Power Cycling Capabilities of SiC Power MOSFET and Si IGBT Baseplate-Less Power Modules

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