Influence of the deposition potential on the structure and composition of the CdTe films electrodeposited on stainless steel substrates

A novel cage-like CdTe film with enhanced photoelectrochemical performance

“…This result indicates a preferential orientation of the products with the (111) plane perpendicular to the substrate, which is similar to the previous reports. [37][38][39] For the samples annealed at different temperatures, it is worthwhile to note that with the annealing temperature increasing, the intensity of CdTe (111) peak initially increases, and then decreases, indicating that the annealing temperatures signicantly affect the crystalline quality of CdTe lms. This phenomenon can be also observed from reference paper.…”

Recent Developments of Flexible CdTe Solar Cells on Metallic Substrates: Issues and Prospects

“…Such measures, referred to as back surface field (BSF) increases cell performance by reducing the recombination at the back contact, leading to improved V oc and reduced series resistance [44,46]. Some commonly used metals and semiconductors, either alone or in combination with others (especially Cu), as back contact layers on glass include C : Cu, Cu, Au, Ag, Sb, Ni, Mo, Te, ZnTe, Sb 2 Te 3 , As 2 Te 3 , CuTe, and HgTe, [6,12,24,26,29,32,44,[47][48][49] When some of these were used in flexible cells, improved cell performances were observed.…”

“…While stress increases with sublimation temperature, preferential orientation and lattice parameter decrease with increasing temperature. By using Au and Pd interlayer between Mo and CdTe, Mathew [6,24,47] reported reduced contact resistance. In addition there were differences in the surface roughness and grain sizes for films deposited on Mo/Au and Mo; films on Mo/Au are larger than those on Mo, as in Figure 2.…”

“…Electrodeposition is a simple, economic and successful, thus attractive method for preparing large-area thin films, on both glass and metallic substrates, with several reported results of electrodeposited CdTe films [40,45,47,52,53]. The technique has good material utilization since deposition takes place on the substrates only, unlike most other techniques such as CSS and sputtering where deposited material is difficult to control.…”

“…The ED of CdTe on metallic substrates is easier and faster than that on the ITO or ITO/CdS substrates. Uniform CdTe films can be easily deposited and the composition of the deposit can be controlled by varying the deposition potential [47,54,55]. In superstrates, this method can be utilized, in place of the bromine etching, to develop a thin Te-rich layer for the metallic contact deposition between the p-CdTe and the substrate.…”