Influence of the filler content on the thermal expansion behavior of an epoxy matrix particulate composite

Tognana, S.; Salgueiro, W.; Somoza, A.; Pomarico, Juan A.; Ranea‐Sandoval, H. F.

doi:10.1016/j.mseb.2008.12.003

Cited by 31 publications

(22 citation statements)

References 14 publications

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“…In the last few decades, composites based on conducting fillers incorporated in the insulator matrices have been a focus of research (Tognana et al, 2009;Canavese et al, 2012;Abyaneh et al, 2006Abyaneh et al, , 2007. Different metal and semiconductor fillers reinforced into the insulators can enhance the electrical conductivity of the host materials are now widely used in circuit breakers, electromagnetic shielding, electrical heating, antistatic devices, etc.…”

Section: Introductionmentioning

confidence: 99%

Piezoresistivity and Mechanical Behavior of Metal-polymer Composites under Uniaxial Pressure

Abyaneh¹,

Ekar²,

Kulkarni³

2012

JMSR

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The piezoresistive response of copper and nickel particles reinforced polydimethylsiloxane (PDMS) polymer, forming metal-polymer composites were investigated under uniaxial pressure. Electrical and mechanical properties of composite samples containing Cu and Ni conductive fillers at different loadings in polydimethylsiloxane (PDMS) polymer matrix have been presented here. Well-dispersed metal-polymer composites were fabricated by a wet mixing route. The resulting Cu-PDMS and Ni-PDMS composite samples show the resistivity changes by more than 2 and 10 orders of magnitude around 4MPa pressure, respectively. The mechanical tests have shown that these composite samples have high stress sensitivity which makes them good piezoresistive candidates for practical applications.

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Section: Introductionmentioning

confidence: 99%

Piezoresistivity and Mechanical Behavior of Metal-polymer Composites under Uniaxial Pressure

Abyaneh¹,

Ekar²,

Kulkarni³

2012

JMSR

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“…The objectives of such study are to investigate the effect produced by the inclusion of different kind of particles, with typical sizes of a hundred of micrometers, in an epoxy matrix and their influence on the thermal residual stresses (see for examples Refs. [10][11][12]). …”

Section: Introductionmentioning

confidence: 99%

Measurement of the Young's modulus in particulate epoxy composites using the impulse excitation technique

Tognana

Salgueiro

Somoza

et al. 2010

Materials Science and Engineering: A

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“…The present work is a continuation of a more general framework of study of epoxy-based composites containing different kinds of particles, in which some of the authors are involved. The main goals pursued are to investigate the effect produced by the inclusion of different kinds of particles, with a typical size of 100 !m, in an epoxy matrix and their influence on the thermal residual stresses [12][13][14][15]. The present work focuses on both types of composites (catalyzed and non-catalyzed) using micro-Raman spectroscopy.…”

mentioning

confidence: 99%

A micro-Raman study of Cu-particulate-filled epoxy matrix composites

Tognana¹,

Salgueiro²,

Valcarce³

2014

Express Polym. Lett.

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Epoxy resins are used in structural applications ranging from high-performance composites for aerospace applications to encapsulants for the microelectronics industry because of their high thermal resistance, high tensile strength and modulus, and good chemical resistance. It is well known that the most important factors that influence their performance are the molecular architecture, the ratio between the epoxide and the hardener, and the cure conditions, frequently at a high temperature, which determine the final properties of the material. The influence of the filler particles on the curing is still a subject of study and clearly depends on the nature of the particles [1][2][3][4][5]. Epoxy matrix composites find new applications every day in several areas of engineering and technology. For example, copper-filled composites have a high possibility of being used in microelectronics because the high thermal conductivity of copper allows the composite to be a good heat dissipator, which serves as protection to electronic devices [6,7]. The matrix-particle interphases also play an important role. The physical properties of the polymeric composites can be significantly influenced by their thermal history; in fact, internal stresses are developed during the fabrication process and further thermal treatments. Abstract. A micro-Raman study is carried out to investigate the influence of the filler on the curing process of bisphenol A diglycidyl ether (DGEBA)-based epoxy matrix composites. The composites are cured (14 h at 393 K) with an anhydride (methyl tetrahydro phthalic anhydride, MTHPA, 100:90 pbw), catalyzed with a tertiary amine (0.7 pbw) and filled with a 30% volume of Cu particles of approximately 75 !m in diameter. The experimental results are compared with those obtained for the same epoxy resin unfilled and for the same composite with Cu filler but not catalyzed. The micro-Raman experimental technique is used to search for information on the curing process in different regions of the matrix, near to and far from the copper filler, taking into account the results of differential-scanning-calorimetry measurements performed on the same composites. The results provide information on the influence of the copper filler on the curing process of the epoxy matrix. Differences were observed in the peaks associated with the epoxy ring and the ester group as a function of the distance to the nearest copper particle, but no differences were observed between the different composites.

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Influence of the filler content on the thermal expansion behavior of an epoxy matrix particulate composite

Cited by 31 publications

References 14 publications

Piezoresistivity and Mechanical Behavior of Metal-polymer Composites under Uniaxial Pressure

Piezoresistivity and Mechanical Behavior of Metal-polymer Composites under Uniaxial Pressure

Measurement of the Young's modulus in particulate epoxy composites using the impulse excitation technique

A micro-Raman study of Cu-particulate-filled epoxy matrix composites

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