2002
DOI: 10.1016/s0921-5093(01)01886-x
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Influence of the microstructure on the interreaction of Al/Ni investigated by tomographic atom probe

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Cited by 26 publications
(16 citation statements)
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“…As a result, Al 3 Ni or a mixture of Al 3 Ni and Al solid solution in Ni were formed. It was reported [24,27,29,[45][46][47] that the manufacturing process parameters, such as the build-up of the stacked sandwich sample, the strain levels, and ensuing defect concentration, alter the phase formation sequence and their growth kinetics. Although further verification is required to clarify the effect of these parameters in a comprehensive manner, a large number of reports have confirmed that the first kinetically favored intermetallic phase is the Al 3 Ni compound.…”
Section: Atomic Diffusivity Observationsmentioning
confidence: 99%
“…As a result, Al 3 Ni or a mixture of Al 3 Ni and Al solid solution in Ni were formed. It was reported [24,27,29,[45][46][47] that the manufacturing process parameters, such as the build-up of the stacked sandwich sample, the strain levels, and ensuing defect concentration, alter the phase formation sequence and their growth kinetics. Although further verification is required to clarify the effect of these parameters in a comprehensive manner, a large number of reports have confirmed that the first kinetically favored intermetallic phase is the Al 3 Ni compound.…”
Section: Atomic Diffusivity Observationsmentioning
confidence: 99%
“…106 Other researchers have performed fundamental studies of phase stability and interdiffusion. 107,131,132 There is an excellent match between the strengths of the atom probe technique and the needs of this application area. The ability to characterize buried interfaces compositionally in a three-dimensional image is the key.…”
Section: Multilayer Filmsmentioning
confidence: 99%
“…The Al-Ni system was chosen as a model system since it is both attractive for applications, e.g. in superalloys or as coatings of III-V semiconductors, and has also been studied thoroughly concerning the microstructure-and the phase evolution [10,11,[13][14][15][16][17][18][19][20][21]. In the studies reported so far, thin Al/Ni multilayers have mostly been deposited by sputtering [17,19,20] or electron-beam evaporation [16,[19][20][21], while repeated folding and cold rolling of Al and Ni foils was also applied as an alternative process to synthesize Al-Ni multilayer foils [10-12, 14, 18].…”
mentioning
confidence: 99%
“…This is explained by the asymmetry of the interdiffusion coefficients, with Ni diffusing much more rapidly into Al than Al into Ni [22,23]. However, depending on the nominal composition of the multilayer and on the processing history, also different initial intermediate phases such as AlNi [19,20,[24][25][26], AlNi 3 [10] or a metastable Al 9 Ni 2 -phase [24,27] Argon flow for 2 min at 250°C. This temperature was chosen because it is close to the onset for the Al 3 Ni formation [12,14,17,18], and the duration was sufficiently short to avoid significant grain growth.…”
mentioning
confidence: 99%