Influence of the substrate on the annealing behaviour of sputter-deposited NiCr films

Anklam, H.‐J.

doi:10.1016/0040-6090(84)90525-x

Cited by 11 publications

(5 citation statements)

References 6 publications

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“…The annealing process may have induced changes in the TFR microstructure and=or film stress, which affected the electrical behaviour of the resistors. A decrease in resistance has previously been observed [16][17][18][19][20][21] and attributed to structural changes (grain-size growth or precipitation). The resistor values were usually stabilized after thermal annealing, via oxidation of chromium, which forms a passivation layer.…”

Section: Resultsmentioning

confidence: 74%

“…A decrease in resistance has previously been observed [16][17][18][19][20][21] and attributed to structural changes (grain-size growth or precipitation). The resistor values were usually stabilized after thermal annealing, via oxidation of chromium, which forms a passivation layer.…”

Section: Resultsmentioning

confidence: 97%

“…Various TFR resistor studies 11,16,17 have reported that substrate parameters may also influence the thin film resistor properties and stability.…”

Section: Resultsmentioning

confidence: 99%

“…The other potential source of reduction of the NiCr sheet resistance in the MMIC process is more likely due to the thermal treatments performed after NiCr evaporation, such as inter-metal contact annealing or BCB curing. Various TFR resistor studies 11,16,17 have reported that substrate parameters may also influence the thin film resistor properties and stability.…”

Section: Resultsmentioning

confidence: 99%

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Investigation of NiCr Thin Film Resistors for InP-Based Monolithic Microwave Integrated Circuits (MMICs)

Driad

Krieg

Geldmacher

et al. 2011

J. Electrochem. Soc.

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We report a systematic study of nickel chrome (NiCr) thin film resistors (TFRs) used as resistors in InP-based monolithic microwave integrated circuits (MMICs). The effects of fabrication process parameters (such as surface treatments or thermal cycles) and substrate materials on the electrical properties of NiCr TFRs are discussed. After completion of MMIC fabrication, the NiCr thin film resistors were found to exhibit lower sheet resistance (R sh ) as compared to the as-deposited films. The origin of this variation has been found to be mainly related to the post-NiCr thermal cycles involved in the IC process technology. In contrast, the R sh values of NiCr TFRs deposited on GaAs or SiN x coated substrates were almost unaffected by thermal annealing. Hence, a thin SiN x passivation layer on the InP substrate has been integrated in the InP-based MMIC process to avoid the NiCr-InP interaction. As a result, NiCr thin film resistors with high sheet resistance uniformity and reproducibility, as well as low temperature coefficient of resistance (TCR) have been achieved. Moreover, the use of a SiN x layer on the InP substrate was also found to improve the inter-device isolation.Although novel material resistors have been developed, nickel chromium (NiCr), and tantalum nitride (TaN) remain the thin film resistors (TFRs) of choice for most applications in the microelectronic industry because of their wide resistivity range, low temperature coefficient of resistance (TCR), good reproducibility and good compatibility with various integrated circuit technologies. In particular, NiCr and related materials have been the subject of numerous investigations, 1-12 covering different aspects of deposition techniques and material properties, as well as potential applications.In monolithic microwave integrated circuit (MMIC) technologies, TFRs are extensively used in feedback circuits, bias circuits, and as terminations. Owing to their properties, they are particularly attractive components for analog and mixed signal circuits, which require precise control of the resistance and thermal stability of the TFR, such as operational amplifiers, and analog to digital converters (ADCs).NiCr resistors are usually deposited as very thin layers (tens of nanometers), directly on the substrate or on dielectric polymer layer, using standard sputtering or e-beam evaporation techniques. As for other thin film resistors, the TCR and resistance of NiCr has, however, been reported to be affected by various process parameters (temperature, composition) and environmental conditions, 2,7,8 which might be at the origin of various performance and reliability problems encountered in integrated circuit.Concerning the properties of NiCr films deposited on III-V substrates, only a few results have, so far, been reported in the literature. Shen et al. 1 compared the characteristics of NiCr, TaN and NiV (nickel vanadium) thin film resistors intended for use in GaAsbased power amplifiers. While TaN and NiV TFRs were directly sputtered on GaAs substrates, NiCr fi...

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Section: Resultsmentioning

confidence: 74%

Section: Resultsmentioning

confidence: 97%

“…Various TFR resistor studies 11,16,17 have reported that substrate parameters may also influence the thin film resistor properties and stability.…”

Section: Resultsmentioning

confidence: 99%

Section: Resultsmentioning

confidence: 99%

See 2 more Smart Citations

Investigation of NiCr Thin Film Resistors for InP-Based Monolithic Microwave Integrated Circuits (MMICs)

Driad

Krieg

Geldmacher

et al. 2011

J. Electrochem. Soc.

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show abstract

“…The TCR control of the Ni-Cr resistors by using Au, Al and O 2 as dopants in films has been extensively discussed [6,7]. Effects of substrate nature [8,9] or resistor-conductor combination on the effective TCR of the resistors have also been theoretically and experimentally dealt with and reported in literature [10][11][12]. However, the dependence of the TCR of thin film resistors on the process parameters of their fabrication has never been reported in the literature.…”

Section: Introductionmentioning

confidence: 99%

Ni–Cr thin film resistor fabrication for GaAs monolithic microwave integrated circuits

et al. 2006

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Temperature dependence of aging drift in CuNi films on alumina ceramic substrates

Brückner¹,

Schumann²,

Griessmann³

1993

Phys. Stat. Sol. (a)

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Influence of the substrate on the annealing behaviour of sputter-deposited NiCr films

Cited by 11 publications

References 6 publications

Investigation of NiCr Thin Film Resistors for InP-Based Monolithic Microwave Integrated Circuits (MMICs)

Investigation of NiCr Thin Film Resistors for InP-Based Monolithic Microwave Integrated Circuits (MMICs)

Ni–Cr thin film resistor fabrication for GaAs monolithic microwave integrated circuits

Temperature dependence of aging drift in CuNi films on alumina ceramic substrates

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