Influence of TiO2 nanoparticles on IMC growth in Sn–3.0Ag–0.5Cu–xTiO2 solder joints during isothermal aging process

Tang, Yu; Li, G. Y.; Chen, D. Q.; Pan, Y.C.

doi:10.1007/s10854-013-1675-3

Cited by 27 publications

(12 citation statements)

References 23 publications

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“…Importantly, with the advancement in the nanotechnology, many new nanoparticles have been synthesized and used as the dispersed phases in the solders (i.e., the nanocomposite solders) to enhance their mechanical properties [10]. However, the improvement in the fatigue strength and creep resistance comes with the alteration of the other properties of the solder, such as wettability and microstructure [11][12][13][14][15][16][17][18][19].…”

Section: Introductionmentioning

confidence: 99%

Effects of Zinc Oxide Nanoparticles on Properties of SAC0307 Lead‐Free Solder Paste

Kanlayasiri

Meesathien

2018

Advances in Materials Science and Engineering

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is research investigates the effects of zinc oxide (ZnO) nanoparticles of varying concentrations 0.0, 0.25, 0.50, 0.75, and 1.0 wt.% on the melting temperatures, wettability, printability, slump, and interfacial microstructure of the ZnO-doped Sn-0.3Ag-0.7Cu lead-free solder pastes on the copper substrate. e results revealed that the introduction of the ZnO particles had no effect on the solidus and liquidus temperatures of the solders. e maximum wettability was achieved with 0.25 wt.% ZnO nanoparticles, while the printability was inversely correlated with the nano-ZnO concentrations. e findings also indicated that, at room temperature, the slumping and the nano-ZnO concentrations were positively correlated and that, under the 150°C thermal condition, the maximum slumping was achieved with 0.25 wt.% ZnO. e slumping mechanism of the SAC0307-xZnO solder pastes is also provided herein. Moreover, the experiments showed that Cu 6 Sn 5 was the single intermetallic compound present in the interfacial layer between the solders and the copper substrate, with the maximum intermetallic layer thickness realized at the 0.25 wt.% ZnO concentration.

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Section: Introductionmentioning

confidence: 99%

Effects of Zinc Oxide Nanoparticles on Properties of SAC0307 Lead‐Free Solder Paste

Kanlayasiri

Meesathien

2018

Advances in Materials Science and Engineering

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“…In addition, NiO (Chellvarajoo and Abdullah, 2016), Fe 2 NiO 4 (Chellvarajoo et al, 2015a(Chellvarajoo et al, , 2015b, diamond (Chellvarajoo et al, 2015a(Chellvarajoo et al, , 2015b and TiO 2 nanoparticles are also used to reinforce the microstructure and mechanical properties of lead-free solders. The addition of TiO 2 nanoparticles into SAC solder improves the hardness value by up to 34 per cent compared to plain SAC305 (Tang et al, 2014a(Tang et al, , 2014b, and slightly improves the tensile properties. Moreover, the average size and spacing of the intermetallic compound (IMC) layer are reduced by the presence of TiO 2 nanoparticles in the SAC solder (Tsao, 2011).…”

Section: Introductionmentioning

confidence: 99%

“…An excessive amount of TiO 2 will decrease the beneficial effects of the nanoparticles on the solder materials, and might create unexpected features in the solder. Besides, other factors such as aging temperature, aging time (Tang et al, 2014a(Tang et al, , 2014b and reflowing time (Tang et al, 2015) also influence the thickness of IMC layer. The IMC layer of SAC-TiO 2 increases with the increasing of aging temperature and time.…”

Section: Introductionmentioning

confidence: 99%

SAC–xTiO₂ nano-reinforced lead-free solder joint characterizations in ultra-fine package assembly

Ani

Jalar

Saad

et al. 2018

SSMT

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Purpose-This paper aims to investigate the characteristics of ultra-fine lead-free solder joints reinforced with TiO 2 nanoparticles in an electronic assembly. Design/methodology/approach-This study focused on the microstructure and quality of solder joints. Various percentages of TiO 2 nanoparticles were mixed with a lead-free Sn-3.5Ag-0.7Cu solder paste. This new form of nano-reinforced lead-free solder paste was used to assemble a miniature package consisting of an ultra-fine capacitor on a printed circuit board by means of a reflow soldering process. The microstructure and the fillet height were investigated using a focused ion beam, a high-resolution transmission electron microscope system equipped with an energy dispersive X-ray spectrometer (EDS), and a field emission scanning electron microscope coupled with an EDS and X-ray diffraction machine. Findings-The experimental results revealed that the intermetallic compound with the lowest thickness was produced by the nano-reinforced solder with a TiO 2 content of 0.05 Wt.%. Increasing the TiO 2 content to 0.15 Wt.% led to an improvement in the fillet height. The characteristics of the solder joint fulfilled the reliability requirements of the IPC standards. Practical implications-This study provides engineers with a profound understanding of the characteristics of ultra-fine nano-reinforced solder joint packages in the microelectronics industry. Originality/value-The findings are expected to provide proper guidelines and references with regard to the manufacture of miniaturized electronic packages. This study also explored the effects of TiO 2 on the microstructure and the fillet height of ultra-fine capacitors.

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“…In order to improve the reliability and performance of the electronic assembly, various types of nanoparticles have been used as the reinforced material doped in the molten solder [1]. The presence of foreign element in lead free solder such as aluminum oxide (Al2O3), nickle oxide (NiO), and titanium dioxide (TiO2) have changed the mechanical properties and microstructure of the lead free solder [2,3,4]. Y. Tang et al found that the hardness value of reinforced solder with TiO2 nanoparticles increases by 34% [5] and wettability of the solder material was improved at 0.05-0.1 wt% nanoparticles [6].…”

Section: Introductionmentioning

confidence: 99%

Discrete Phase Model (DPM) study of nano-reinforced Lead Free Solder Sn-3.0Ag-0.5Cu (SAC305)

Mukhtar¹,

Abas

Haslinda

et al. 2018

IOP Conf. Ser.: Mater. Sci. Eng.

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Abstract. This paper presents a preliminary study of the interaction between two models of numerical simulation namely volume of fluid (VOF) and discrete phase model (DPM). The multiphase-DPM model is capable of tracking the trajectory of the TiO2 nanoparticles that has been doped in the lead free solder Sn-3.0Ag-0.5Cu (SAC305). The current model was developed based on passive surface mount component 01005 capacitor that undergoes conventional reflow process. The trajectory of the nanoparticles at 0.01, 0.05 and 0.15wt% in the molten solder is shown in the flow front of the wetted molten solder. At 0.05wt% of nanoparticles, good dispersion of nanoparticles, pressure distribution and wetting time was found. The difference in wetting time are about 3.76% and 0.46% for 0.05wt% and 0.15wt% compared to 0.01wt% nanoparticle. The trajectory of the nanoparticles are shown to move along with the wetting formation of the molten solder. The pressure distribution and velocity vector of the different weight percentage of nanoparticles are also be studied. Higher pressure distribution is found at the capacitor area and intermetallic compound (IMC) region. The higher pressure distribution projected to reduce the micro void formation and optimize the reliability of the solder joint.

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Influence of TiO2 nanoparticles on IMC growth in Sn–3.0Ag–0.5Cu–xTiO2 solder joints during isothermal aging process

Cited by 27 publications

References 23 publications

Effects of Zinc Oxide Nanoparticles on Properties of SAC0307 Lead‐Free Solder Paste

Effects of Zinc Oxide Nanoparticles on Properties of SAC0307 Lead‐Free Solder Paste

SAC–xTiO₂ nano-reinforced lead-free solder joint characterizations in ultra-fine package assembly

Discrete Phase Model (DPM) study of nano-reinforced Lead Free Solder Sn-3.0Ag-0.5Cu (SAC305)

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Influence of TiO2 nanoparticles on IMC growth in Sn–3.0Ag–0.5Cu–xTiO2 solder joints during isothermal aging process

Cited by 27 publications

References 23 publications

Effects of Zinc Oxide Nanoparticles on Properties of SAC0307 Lead‐Free Solder Paste

Effects of Zinc Oxide Nanoparticles on Properties of SAC0307 Lead‐Free Solder Paste

SAC–xTiO2 nano-reinforced lead-free solder joint characterizations in ultra-fine package assembly

Discrete Phase Model (DPM) study of nano-reinforced Lead Free Solder Sn-3.0Ag-0.5Cu (SAC305)

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Product

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SAC–xTiO₂ nano-reinforced lead-free solder joint characterizations in ultra-fine package assembly