“…Thus, in the case of GaNbased compounds grown on Si, the stress is known to severely affect the device quality because of wafer bending, dislocation formation, or even cracks. [1] In order to counterbalance the tensile stress, many solutions have been researched such as low-temperature AlN (LT-AlN) interlayer, [2][3][4] GaN/AlN superlattices structure, [5][6][7] single AlGaN interlayer, [8,9] stepgraded AlGaN buffer layer, [10][11][12][13][14] composition-graded AlGaN buffer layer, [15][16][17][18][19] etc.…”