Influence of via holes on signal integrity of Multilayer PCB transmission lines

Lin, Xueyan; An, Xin

doi:10.1109/aemcse51986.2021.00175

Cited by 4 publications

(2 citation statements)

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“…In multilayer boards, when current passes through the via, a parallel plate mode occurs between the reference planes [2][3][4], leading to the excitation of electromagnetic waves and resonance phenomena [5]. By adding ground vias around the signal via, resonance can be effectively suppressed [6]. This paper presents the design process of a high-frequency test board and provides a detailed description.…”

Section: Introductionmentioning

confidence: 99%

Design of high-frequency test fixture considering impedance matching

Peng,

Cai,

Yang

et al. 2024

International Conference on Mechatronic Engineering and Artificial Intelligence (MEAI 2023)

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This paper presents the design of a high-frequency test fixture for high-speed connectors. Specifically, after analyzing and designing the board material, laminate structure, trace structure, and signal via structure, the impedance consistency and bandwidth of the high-speed interconnect structure are verified through TDR and S-parameter simulations conducted in HFSS. a PCB layout is generated using Cadence. The test results confirm that the differential impedance of the fixture meets the requirements for high-speed connector testing. Within the frequency range of 0-30 GHz, the difference between S11 and S21 for the 2x-thru structure is greater than 0 dB, indicating a bandwidth capability of up to 30 GHz for the fixture.

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Section: Introductionmentioning

confidence: 99%

Design of high-frequency test fixture considering impedance matching

Peng,

Cai,

Yang

et al. 2024

International Conference on Mechatronic Engineering and Artificial Intelligence (MEAI 2023)

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show abstract

“…Microholes in PCB are the channels for the signal connection between layers, while the excess invalid hole copper in through hole would cause signal delay, reflection and resonance, which destroy the integrity of high-speed signal. In order to achieve higher speed signal transmission, highspeed PCBs are usually back-drilled [1] [2]. Back-drilling is a secondary drilling method, in which copper plated through-holes are drilled from the back to remove excess copper (Fig.…”

Section: Introductionmentioning

confidence: 99%

Chip removal mechanism and hole plugging in back-drilling of high-speed printed circuit board

Chen,

Shi,

Zhu

et al. 2024

Preprint

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Micro-holes are channels for signal connection between layers of printed circuit boards (PCBs), and excess invalid hole copper in through holes can destroy the integrity of signal, which is usually removed by back-drilling. However, as high-speed PCBs evolve towards miniaturization and high density, it is difficult to remove chips during back-drilling and easily cause micro-holes plugging, seriously affecting the performance of high-speed PCBs and even leading to scrap. Therefore, the chip removal mechanism of high-speed PCB back-drilling is studied to solve hole plugging in this paper. Firstly, kinematics method is used to analyze the mechanical behavior and motion law of chip formation, and then the expressions of chip removal force and chip moving speed are proposed. Secondly, the chip removal model of backdrilling is established, an evaluation index of chip removal capability is put forward, and the influence rule of machining parameters on chip removal of back-drilling is analyzed afterwards. Finally, back-drilling experiments of high-speed PCB are carried out to observe the chips winding around drill bit and calculated the hole plugging rate of back-drilling. The experimental result demonstrates that the number and density of winding chips in the drill bit slightly decrease with the increase of feed rate, and the hole plugging rate rises almost proportionally. Increasing the spindle speed can greatly improve the chip winding of tools and hole plugging, and effectively reduce the chip removal force of back-drilling. The research presented provides theoretical guidance for solving the bottleneck problem of micro-holes plugging during backdrilling in the high-speed PCB industry.

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Influence of Via Stubs on Signal Integrity of Multi-layer PCB Boards

Lin

Zhou

2022

Lecture Notes in Electrical Engineering

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Influence of via holes on signal integrity of Multilayer PCB transmission lines

Cited by 4 publications

References 0 publications

Design of high-frequency test fixture considering impedance matching

Design of high-frequency test fixture considering impedance matching

Chip removal mechanism and hole plugging in back-drilling of high-speed printed circuit board

Influence of Via Stubs on Signal Integrity of Multi-layer PCB Boards

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