Influences of Ag and In alloying on Sn-Bi eutectic solder and SnBi/Cu solder joints

Wang, Z.; Zhang, Qingke; Chen, Y. X.; Zhang, Song

doi:10.1007/s10854-019-02206-y

Cited by 41 publications

(16 citation statements)

References 40 publications

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“…Sn-Bi-(0.2-0.5)%Ag solders are also popular for a low-temperature application, which has high ductility, good wettability, a suitable mechanical property, and a low melting point [34][35][36][37]. To overcome the problems mentioned above, many studies have been performed, such as grain refinement by the addition of various alloying elements like Ag, Cu, Ni, In, Al, Sb, and so on [19][20][21][22]. Addition of nanoparticles or fibers like CNT, Y 2 O 3 , Al 2 O 3 , ZrO 2 , TiO 2 , Cu, and Ni to solders is another approach [23][24][25][26][27][28].…”

Section: Effect Of Alloying Addition On the Melting Temperature Of Sn-bi Soldermentioning

confidence: 99%

“…However, Sn-Bi eutectic solder has some drawbacks like low ductility and poor fatigue properties [18]. To overcome the problems mentioned above, many studies have been performed, such as grain refinement by the addition of various alloying elements like Ag, Cu, Ni, In, Al, Sb, and so on [19][20][21][22]. Addition of nanoparticles or fibers like CNT, Y2O3, Al2O3, ZrO2, TiO2, Cu, and Ni to solders is another approach [23][24][25][26][27][28].…”

Section: Introductionmentioning

confidence: 99%

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Low Melting Temperature Sn-Bi Solder: Effect of Alloying and Nanoparticle Addition on the Microstructural, Thermal, Interfacial Bonding, and Mechanical Characteristics

Kang

Rajendran

Jung

2021

Metals

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Sn-based lead-free solders such as Sn-Ag-Cu, Sn-Cu, and Sn-Bi have been used extensively for a long time in the electronic packaging field. Recently, low-temperature Sn-Bi solder alloys attract much attention from industries for flexible printed circuit board (FPCB) applications. Low melting temperatures of Sn-Bi solders avoid warpage wherein printed circuit board and electronic parts deform or deviate from the initial state due to their thermal mismatch during soldering. However, the addition of alloying elements and nanoparticles Sn-Bi solders improves the melting temperature, wettability, microstructure, and mechanical properties. Improving the brittleness of the eutectic Sn-58wt%Bi solder alloy by grain refinement of the Bi-phase becomes a hot topic. In this paper, literature studies about melting temperature, microstructure, inter-metallic thickness, and mechanical properties of Sn-Bi solder alloys upon alloying and nanoparticle addition are reviewed.

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Section: Effect Of Alloying Addition On the Melting Temperature Of Sn-bi Soldermentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Low Melting Temperature Sn-Bi Solder: Effect of Alloying and Nanoparticle Addition on the Microstructural, Thermal, Interfacial Bonding, and Mechanical Characteristics

Kang

Rajendran

Jung

2021

Metals

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“…Hence the RoHS directive was introduced in the European Union, EU in 2006 to prohibit the use of toxic and harmful elements in all electronic devices such as lead (Pb,) mercury (Hg) and cadmium (Cd) [1]. As a result, researchers and the electronics manufacturing industry have focusing their efforts on developing Pb-free solder to replace Sn-Pb solder which resulting new Pb-free solders such as Sn-Zn [1], Sn-Bi [2], Sn-Cu [3] and Sn-Ag.…”

Section: Introductionmentioning

confidence: 99%

“…One of the methods is by microalloying, i.e introduce lower melting point element that could also impede diffusion of active elements. Reports explaining about alloying to reduce melting temperature have been published, for example alloying of Ge [2], Bi [3] [4]and In [5]. Bi alloying has been reported to lower melting temperature of Sn-based solder but limited at small percentage as higher than its solubility limit, brittle pure Bi phase precipitate and would induce reliability issue [6].…”

Section: Introductionmentioning

confidence: 99%

The Influence of Indium, In on Microstructure Evolution During Isothermal Aging of Sn-0.7Cu

Ghazali

Sharif

2022

J. Phys.: Conf. Ser.

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This paper reports influence of isothermal aging on bulk solder and the microstructure evolution of commercial Sn-0.7Cu (Sn-0.7Cu-0.05Ni+Ge) Pb-free solder alloy with addition of bismuth (Bi) and indium (In). Sn-0.7Cu, Sn-0.7Cu-1.0Bi, Sn-0.7Cu-1.0Bi-1.0In, Sn-0.7Cu-1.0Bi-4.0In, Sn-0.7Cu-1.0Bi-7.0 In solder alloys were prepared via casting process. The solder alloys were aged isothermally at 180°C for 500 hours and microstructure was compared with that of as-cast solder. Microstructure of bulk solder and melting temperatures were analysed via scanning electron microscopy, SEM and differential scanning calorimetry, DSC. The addition of In up to 7 wt% reduced the melting temperature from 231.1 to 218.5°C, and crystallisation temperature from 205.8 to 194.7°C with decreasing degree of undercooling which indicates that the In-added solder alloy had faster nucleation rate. Microstructure evaluation showed that as the amount of indium added increased to 7.0 wt%, the ß-Sn grains became smaller suggesting a refinement effect with In addition. Indium addition also encouraged the formation of Sn-In and Bi-In IMC which increased as the amount of In increased. These IMCs could potentially act as blocking mechanism for deformation leading to higher strength.

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“…용융 범위 (융점 피크온도, 133.7℃)를 갖는 것으로 보고되었으며 Sn-58Bi+4%Ag의 융점은 1℃ 이내로 강하됨을 알 수 있다. Sn58Bi+3%In-4%Ag 복합 첨가는 116.9℃ (고상온도) ~ 134.1℃ (액상온도)의 용융 범위 (융점 피크온도, 138.1℃)로 보고되었다15) .…”

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Recent Low Temperature Solder of SnBi and Its Bonding Characteristics

Kang¹,

Baek²,

Jung³

2020

Journal of Welding and Joining

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A solder has been extensively used for long time in electronics packaging field, and there are various Sn-based lead-free solders such as SnAg -Cu, Sn-Cu, Sn-Bi and etc. Recently, the low temperature solder, typically Sn-58wt%Bi-X alloys, attract attention from industry because of flexible printed circuit board (FPCB) application and to avoid bending or warpage of big size electronic devices after high temperature soldering. In the Sn-58wt%Bi-X solder, basic important issues are melting temperature, wettability, microstructure, mechanical properties and etc. Specifically, the Sn-58wt%Bi-X solder receives much attention to improve the brittleness by grain refinement of Bi-phase. In this paper, recent studies about Sn-58wt%Bi-X solders were reviewed including melting temperature, microstructure and mechanical properties.

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Influences of Ag and In alloying on Sn-Bi eutectic solder and SnBi/Cu solder joints

Cited by 41 publications

References 40 publications

Low Melting Temperature Sn-Bi Solder: Effect of Alloying and Nanoparticle Addition on the Microstructural, Thermal, Interfacial Bonding, and Mechanical Characteristics

Low Melting Temperature Sn-Bi Solder: Effect of Alloying and Nanoparticle Addition on the Microstructural, Thermal, Interfacial Bonding, and Mechanical Characteristics

The Influence of Indium, In on Microstructure Evolution During Isothermal Aging of Sn-0.7Cu

Recent Low Temperature Solder of SnBi and Its Bonding Characteristics

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