1993
DOI: 10.1117/12.160549
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Infrared readout electronics for space-science sensors: state of the art and future directions

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Cited by 90 publications
(38 citation statements)
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“…The 1/f noise in readout unit cell electronics is an important issue for low background applications involving long integration times. For most unit cell circuits used in IRFPAs, the input-referred noise electrons due to the 1/f noise is directly proportional to integration time, making the IRFPAs noise significantly larger for longer integration times [2]. Other temporal noise sources being of concern for readout electronics are transistor thermal noise and reset noise.…”
Section: Introductionmentioning
confidence: 99%
See 1 more Smart Citation
“…The 1/f noise in readout unit cell electronics is an important issue for low background applications involving long integration times. For most unit cell circuits used in IRFPAs, the input-referred noise electrons due to the 1/f noise is directly proportional to integration time, making the IRFPAs noise significantly larger for longer integration times [2]. Other temporal noise sources being of concern for readout electronics are transistor thermal noise and reset noise.…”
Section: Introductionmentioning
confidence: 99%
“…For many mature infrared focal plane array (IRFPA) detector technologies, it is now the readout electronics that limit scientific performance rather than the detector itself. As a general rule, the readout electronics noise is critically important for the IRFPAs' requirements: integration capacity, integration time, dynamic range, responsivity, and the noise equivalent temperature difference (NETD) [2].…”
Section: Introductionmentioning
confidence: 99%
“…Many current readout circuits for infrared focal plane array (IR FPA) applications have been developed [1,3] to satisfy the requirement of stable detector bias, high injection efficiency, large dynamic range, small area, + and low power consumption. These circuits are composed of self-integration (SI), direct injection (DI), source follower per detector (SFD), gate modulation input (GMI), buffered direct injection (BDI), capacitive feedback transimpedance amplifier (CTIA), switched current integration (SCI), buffered gate modulation input (BGMI), current mirror direct injection (CMDI) [14], and current mirror integration (CMI) [6] elements.…”
Section: Introductionmentioning
confidence: 99%
“…21 Random noise sources are composed of photon shot noise of the incident light, shot noise of the dark current, reset noise of the pixels in the array, and current and voltage noise of the preamplifier. 22 Two other sources of noise are identified in the literature: the amplifier glow noise 23 and popcorn noise. 24 These two sources are not covered here.…”
Section: Operation Of Ingaas Linear Arrays Recent Advances Inmentioning
confidence: 99%