A quantum cascade laser (QCL) thermal model is presented. Based upon a finite-difference approach, the model is used in conjunction with a self-consistent carrier transport model to calculate the temperature distribution in a near-infrared InGaAs/AlAsSb QCL. The presented model is used to investigate the effects of driving conditions and device geometries on the active region temperature, which has a major influence on the device performance. A buried heterostructure (BH) combined with epilayer-down bonding is found to offer the best performance compared to alternative structures and has thermal times constants up to eight times smaller. The presented model provides a valuable tool for understanding the thermal dynamics inside a QCL and will help to improve operating temperatures.