1980
DOI: 10.1063/1.91565
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InGaAsP double heterostructure lasers (λ=1.3 μm) with etched reflectors

Abstract: Discrete InGaAsP double heterostructure lasers (λ=1.3 μm) have been fabricated by a novel batch process which incorporates chemically etched end reflectors. The etched-mirror lasers have threshold current densities as low as 3.5 kA/cm2. The average threshold current density for the etched-mirror lasers is approxiamtely 40% higher than for standard cleaved-mirror devices fabricated from the same wafer. The laser fabrication process permits batch fabrication of a much wider variety of discrete laser geometries t… Show more

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Cited by 18 publications
(9 citation statements)
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“…Subsequent photolithographic steps are used to define Si3N4 masks (150pm x 300pm) aligned over the AuZn contact stripes. As in previous work[2]…”
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confidence: 70%
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“…Subsequent photolithographic steps are used to define Si3N4 masks (150pm x 300pm) aligned over the AuZn contact stripes. As in previous work[2]…”
mentioning
confidence: 70%
“…Recent results for InGaAsP DH lasers (x -1.3 pm) with one chemically-etched mirror and one cleaved mirror indicated that external differential quantum efficiencies of 2.3-4.50'10 (from the cleaved-mirror) could be obtained [3]. In the present work we have fabricated stripe-geometry InGaAsP DH lasers (X = 1.3 pm) with two chemicallyetched mirrors using the mirror-etching procedure described previously [2]. This etching procedure permits the fabrication of laser mirrors which are very smooth and near vertical, and thus have high reflectivity and low scattering loss.…”
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confidence: 93%
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