2008
DOI: 10.1016/j.jcrysgro.2008.01.022
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InGaN/GaN multi-quantum well and LED growth on wafer-bonded sapphire-on-polycrystalline AlN substrates by metalorganic chemical vapor deposition

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Cited by 11 publications
(1 citation statement)
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“…The elevated temperature due to recombination process has aging effect and reduces the device reliability for long life-time application. In addition, the higher temperature and material intrinsic defects induces micro-cracks which is physical damage [20][21]. The defects or micro-cracks is originating from lattice mismatch at nitride/substrate interface.…”
Section: Introductionmentioning
confidence: 99%
“…The elevated temperature due to recombination process has aging effect and reduces the device reliability for long life-time application. In addition, the higher temperature and material intrinsic defects induces micro-cracks which is physical damage [20][21]. The defects or micro-cracks is originating from lattice mismatch at nitride/substrate interface.…”
Section: Introductionmentioning
confidence: 99%