2017 5th International Conference on Electrical Engineering - Boumerdes (ICEE-B) 2017
DOI: 10.1109/icee-b.2017.8192222
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Inhomogeneous barrier height effect on the current-voltage characteristics of a W/4H-Sic Schottky diode

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Cited by 3 publications
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“…In particular, the promising properties of p-type 4H-SiC have not yet been accomplished to their full potential for use in the fabrication of highly efficient power devices depending on the quality of the SiC layers and metal-SiC contacts. The contact formation process for soldering and attaching dies, (e.g., micro or nanoparticle pastes or solders) and their thermal stability as Schottky contacts have been studied to realize their operational requirements and to improve the performance of SiC-based devices [8][9][10][11]. Direct bonding (DB) technology has significant attention in the development of power electronics and micro electromechanical systems [12].…”
Section: Introductionmentioning
confidence: 99%
“…In particular, the promising properties of p-type 4H-SiC have not yet been accomplished to their full potential for use in the fabrication of highly efficient power devices depending on the quality of the SiC layers and metal-SiC contacts. The contact formation process for soldering and attaching dies, (e.g., micro or nanoparticle pastes or solders) and their thermal stability as Schottky contacts have been studied to realize their operational requirements and to improve the performance of SiC-based devices [8][9][10][11]. Direct bonding (DB) technology has significant attention in the development of power electronics and micro electromechanical systems [12].…”
Section: Introductionmentioning
confidence: 99%