2010
DOI: 10.1007/s11671-010-9602-5
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Initial Growth of Single-Crystalline Nanowires: From 3D Nucleation to 2D Growth

Abstract: The initial growth stage of the single-crystalline Sb and Co nanowires with preferential orientation was studied, which were synthesized in porous anodic alumina membranes by the pulsed electrodeposition technique. It was revealed that the initial growth of the nanowires is a three-dimensional nucleation process, and then gradually transforms to two-dimensional growth via progressive nucleation mechanism, which resulting in a structure transition from polycrystalline to single crystalline. The competition amon… Show more

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Cited by 15 publications
(6 citation statements)
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“…Sn–Cu lead-free solder is one of the potential solders in the solder industry due to its various advantages. , There are some literatures based on the synthesis of Sn–Cu lead-free solder from alkaline as well as acidic bath through the electrodeposition method. ,− There are some literatures available regarding the growth analysis of the thin film of different alloys rather than Sn–Cu by employing different techniques, such as computational modeling, electrochemical analysis, , and microstructural characterization. This present work highlights the nucleation and growth mechanism of Sn–Cu solders synthesized via pulsed electrodeposition at different current densities. Although it is near-eutectic, the Cu 6 Sn 5 phase is not considered in this mechanism due to its very low volume fraction, and the nucleation and growth of only the Sn matrix are presented.…”
Section: Introductionmentioning
confidence: 90%
“…Sn–Cu lead-free solder is one of the potential solders in the solder industry due to its various advantages. , There are some literatures based on the synthesis of Sn–Cu lead-free solder from alkaline as well as acidic bath through the electrodeposition method. ,− There are some literatures available regarding the growth analysis of the thin film of different alloys rather than Sn–Cu by employing different techniques, such as computational modeling, electrochemical analysis, , and microstructural characterization. This present work highlights the nucleation and growth mechanism of Sn–Cu solders synthesized via pulsed electrodeposition at different current densities. Although it is near-eutectic, the Cu 6 Sn 5 phase is not considered in this mechanism due to its very low volume fraction, and the nucleation and growth of only the Sn matrix are presented.…”
Section: Introductionmentioning
confidence: 90%
“…The OA growth, frequently the early growth stage of nanomaterials, has a profound influence on the final microstructure and properties of materials. 26,27 Several excellent reviews have summarized the OA phenomenon 28,29 or described kinetic models 30,31 involving this mechanism. However, correlation of the different OA behaviors described by different models as well as elucidation of the impact of surface capping agents requires both a summary of recent developments and further analysis of kinetic data.…”
Section: The Oriented Attachment (Oa) Mechanismmentioning
confidence: 99%
“…[ 178,179 ] The oriented attachment growth occurring at the beginning of the growth process has a significant influence on the final morphology and properties of the materials; therefore, further understanding is required. [ 180 ]…”
Section: Growth Mechanismsmentioning
confidence: 99%