Initial stage of silver electrochemical migration degradation

Yang, Shuang; Wu, Jiaye; Christou, A.

doi:10.1016/j.microrel.2006.07.080

Cited by 63 publications

(33 citation statements)

References 20 publications

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“…The observed deviations were relatively high, since the ECM processes are not stationary and also the electrochemical cell platforms are not homogeneous. Therefore there are no available exact relationships, only empirical models [16,20,21]. Despite the huge deviations, an ECM ranking could be established.…”

Section: Resultsmentioning

confidence: 99%

Electrochemical Migration of Micro-alloyed Low Ag Solders in NaCl Solution

Medgyes

Illés

Harsányi

2013

Per. Pol. Elec. Eng.

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The reliability investigation of lead-free solders is still a current issue. In this paper, Electrochemical Migration (ECM) behaviour of novel lead-free micro-alloyed low Ag content solders was investigated by water drop test in IntroductionIn microelectronics industry, the applied solder materials are one of the most important factors related to the reliability of the products. According to the Restrictions of Hazardous Substances (RoHS) directive of European Union, lead bearing solders had to be replaced with lead-free ones [1]. In this context, alternative binary alloys had been examined as replacements for SnPb solders, such as near-eutectic SnAg, SnCu and SnZn alloys. However, ternaries (SnAgCu, SnZnAg, SnZnIn, etc.) and even quaternary alloys (SnZnAgAl, SnAgBiCu, SnInAgSb) had also been studied as candidates for lead-free solders [2][3][4][5][6][7].The reliability investigation of lead-free solders is still a current issue. One of the important reliability topics is the electrochemical migration (ECM) failure phenomenon. The common characteristics of the ECM phenomenon include the presence of moisture on conductor-dielectric-conductor systems under bias voltage, the electrochemical process and the metallic dendrite growth. This process is driven by the applied electric field from the anode to the cathode. Dendrite growth occurs as a result of metal ions being dissolved into a solution from the anode and deposited at the cathode, thereby growing in needle or tree-like formations. This effect causes short-circuits in electronic circuits, which may lead to a catastrophic failure.Many papers can be found about ECM investigations carried out on different lead-free solder alloys. Takemoto et al. have found that some tin based lead-free solder alloys are more resistant to ECM than Sn-Pb40 alloy and pure Indium. In-48Sn and In-50Pb alloys were found to be immune to ECM in high purity water [8]. Yu et al. have described that in Sn-37Pb and Sn-36Pb2Ag systems the main migration element is Pb, while in Sn-Ag and Sn-Ag-Cu solder alloys Sn leads the migration in high purity water [9,10].Other publication reported that SAC305 lead-free solder alloy has longer ECM lifetime in 0.001% NaCl solution than in 0.001% Na2SO4, since the passivity layer formed of SnO2 is thicker in the case of NaCl solution and Sn is the only element that contributes to ECM at room temperature [11]. The migration behaviour and the deposition process of Sn, Cu and Ag in case of SAC305 solder alloy were also observed in a thermal-

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Section: Resultsmentioning

confidence: 99%

Electrochemical Migration of Micro-alloyed Low Ag Solders in NaCl Solution

Medgyes

Illés

Harsányi

2013

Per. Pol. Elec. Eng.

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“…The interconnection part, elastomer socket, can be replaced with different type of sockets, including metalized particle interconnect (MPI), PariPoser film, and conductive rubber sockets (CRS). Reprint and permission from 16 Several mechanisms can lead to the elastomer failure, such as electrochemical migration [50][51][52] , stress relaxation and creep 45,53 and corrosion 16 . This section will extensively emphasize these mechanisms and use respective models to predict the lifecycle of the components.…”

Section: Elastomer As Electrical Contact Matrix In Microelectronicsmentioning

confidence: 99%

“…This finding indicated that even without dendrite formation a short-circuit can happen. The design of the experiment, which mimicked the device environment with accelerated conditions, was conducted to identify the failure mechanism and electrochemical migration processes based on the failure products [50][51][52] . The new failure mechanism in the metal-in-elastomer socket was proposed on the facts that surface insulation resistance has catastrophically decreased and unknown materials were formed on surface after a certain period of time incubation in the temperature-humidity-bias conditions.…”

Section: Elastomer As Electrical Contact Matrix In Microelectronicsmentioning

confidence: 99%

“…The analysis of film and dendrites from electron scanning spectrometry and X-ray photoelectron microscopy showed that the film consists of silver oxide and dendrites are silver only. The process of the silver electrochemical migration is progressed as follow: silver oxidation at anode to formation of silver ion; silver ion migration from anode to cathode through absorbed water layer (6-7 water monolayers); partial silver ion reduction to silver oxide with hydroxide from water electrolysis (film); other silver ion reduction to formation of silver at the cathode (dendrites) [50][51][52] .…”

Section: Elastomer As Electrical Contact Matrix In Microelectronicsmentioning

confidence: 99%

“…In the IPC standard (IPC-TR-476A), the failure was defined as the surface insulation resistance below 10 6 ohm. New experimental findings showed that the component didn't fail when resistance below the resistance, no electrochemical migration related products detected either [50][51][52] . In addition, the surface insulation resistance immediately decreased to the order of 10 6 ohm when the metal-in-elastomer was conditioned in the highly accelerated stress testing (130C/85% RH/bias).…”

Section: Elastomer As Electrical Contact Matrix In Microelectronicsmentioning

confidence: 99%

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Printing Silver Conductive Inks with High Resolution and High Aspect Ratio

Chu

Zhang

Tao

2018

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Narrow metal lines with low electrical resistance are essential for many printable electronic devices. Printing metal lines of narrower than 10 µm and with a high thickness‐to‐width aspect ratio is very difficult and remains a technical challenge in printable electronics. In this work, by controlling the ink–substrate interaction and ink drying dynamics, 4.6 µm wide inkjet‐printed silver lines are demonstrated with an aspect ratio of 0.7 and an elliptical cross‐section. The silver lines are obtained by jetting a silver nanoparticle‐based ink onto an SU‐8‐coated polyethylene terephthalate substrate to form well‐defined silver lines, and then heating the lines to transform them into high aspect ratio narrow lines through ink dewetting and receding. The simultaneous dissolution and redistribution of SU‐8 by the ink result in a concave structure, which prevents the lines from bulging and allows the lines to become embedded into the SU‐8 film.

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Initial stage of silver electrochemical migration degradation

Cited by 63 publications

References 20 publications

Electrochemical Migration of Micro-alloyed Low Ag Solders in NaCl Solution

Electrochemical Migration of Micro-alloyed Low Ag Solders in NaCl Solution

Elastomer Application in Microsystem and Microfluidics

Printing Silver Conductive Inks with High Resolution and High Aspect Ratio

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