Initial stages of the electrocrystallization of Co–Cu alloys on GCE from the Co rich electrolytes

Gu, Min

doi:10.1016/j.electacta.2006.12.027

Cited by 25 publications

(13 citation statements)

References 18 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…The first stage of the process is found to follow a 3DI regime, with an instantaneous nucleation mode; the deposited crystallite morphology is uniform in size and shape (prismatic), which is consistent with a multidirectional three-dimensional growth pattern. A similar morphology has been reported for short times in Co−Cu films deposited onto glassy carbon, 24 indicating an instantaneous nucleation process as that considered in the Scharifker and Hill model. 14 In the long term (t > 500 s), a mechanism involving 3D progressive regime initiates, which is controlled by incorporation at the interface.…”

Section: Resultssupporting

confidence: 81%

Nucleation and Growth Mechanisms in Cu–Co Films

et al. 2016

View full text Add to dashboard Cite

Nucleation and growth mechanisms in Co, Cu, and Co x Cu 100−x single films, and in Co x Cu 100−x /Cu bilayers, electrodeposited on Cu 70 Zn 30 brass substrates, are studied by the constant potential technique. The recorded current−time transients (CTTs) are rather complex, and they extend for long times. Co, Cu, and Co x Cu 100−x alloys electrocrystallize onto brass, undergoing a process with more than a single maximum during the CTTs, as if two or more consecutive nucleation steps were present. The first stage of electrocrystallization in Co and Co x Cu 100−x films involves 3D instantaneous nucleation, but then, at long times, a progressive nucleation regime predominates. CTTs in Cu/brass and in Cu/Co x Cu 100−x /brass bilayers are well fitted by a 2DP progressive nucleation process at the initial stage, while for longer growing times a transition to a 3DP regime is observed, in which film growth becomes controlled by adatoms incorporation to the lattice. Film morphologies observed by SEM are consistent with these growth mechanisms. XRD results indicate that pure Co layers are hcp phase, while Cu and Cu−Co layers have an fcc lattice. Films are soft ferromagnetic, with an "in-plane" magnetization easy axis; there is evidence of crystallographic texture, which should be responsible for the higher coercivity observed in the "out-ofplane" configuration, with the applied field perpendicular to the film plane.

show abstract

Section: Resultssupporting

confidence: 81%

Nucleation and Growth Mechanisms in Cu–Co Films

et al. 2016

View full text Add to dashboard Cite

show abstract

“…27 By using Scharifker-Hills nucleation model, the corresponding data were calculated as shown in Fig. 2b.…”

Section: Resultsmentioning

confidence: 99%

Influences of Cerium on the Electrodeposition Process and Physicochemical Properties of Lead Dioxide Electrodes

Yao

Cui

Zhao

et al. 2014

J. Electrochem. Soc.

View full text Add to dashboard Cite

The influence of cerium on lead dioxide electrodeposition process on a glass carbon electrode (GCE) from lead nitrate solution was studied by cyclic voltammetry (CV), chronoamperometry (CA) and electrochemical impedance spectroscopy (EIS). Cerium exhibit an inhibition effect on the lead dioxide electrodeposition process. Instantaneous nucleation mechanism can be found for lead dioxide electrodeposition according to Scharifker-Hills' model with three-dimensional growth, which is not influenced by the addition of cerium. The morphology and structure of Ce-doped PbO 2 electrodes were investigated by scanning electron microscopy (SEM) and X-ray diffraction (XRD). The results show that the adulteration of cerium can greatly decrease grain size and make the films more compact. Accelerated lifetime tests demonstrate that the adulteration of cerium can highly lengthen the service life of Ce-doped PbO 2 electrode in its practical application. Methylene blue degradation experiments reveal that the Ce-doped PbO 2 electrodes possess excellent electrocatalytic activity.

show abstract

“…During CA experiments, current-time transients are recorded as the potential is stepped from the opencircuit potential (OCP) to the potential at which the electrodeposition of metals or alloys occurred. 22,23 The Scharifker-Hills model shows two limiting nucleus growth mechanisms, one instantaneous nucleus growth mechanism and one progressive nucleus growth mechanism. 24 The theoretical transients of the instantaneous and the progressive nucleus growth, with three dimensions (3D) under diffusion control, are given by: where I and t are the current density and time, respectively, and I m and t m are the current density and time coordinate values for the current-time transient curve peak, respectively.…”

Section: Resultsmentioning

confidence: 99%

Study on Co-Electrodeposition Mechanism of Au-30at.%Sn Eutectic in Non-Cyanide Bath by Electrochemical Methods

Huang

2017

J. Electrochem. Soc.

View full text Add to dashboard Cite

The co-deposition of Au-30at.%Sn alloy in a non-cyanide alkaline Au + -Sn 2+ bath was successfully achieved with sodium sulfite (Na 2 SO 3 ) and potassium pyrophosphate (K 4 P 2 O 7 ) as green complexing agents, ethylenediamine tetraacetic acid (EDTA) as bath stabilizer and catechol as additive. The Au(I) is mainly complexed with sulfite in the form of [Au(SO 3 ) 2 ] 3− , while the Sn(II) is mainly complexed in the form of [Sn(P 2 O 7 ) 2 ] 6− . The reduction potentials of both Sn(II) and Au(I) shift to a negative value (more negative than −0.70 V vs. SCE) in the presence of sulfite and pyrophosphate complexing agents, resulting in the onset reduction potential gap between Au(I) and Sn(II) decreased from 1.828 V (for standard deposition potential) to 100 mV, and consequently the co-deposition of Au and Sn is realized. The cyclic voltammetry and chronoamperometry characterizations revealed that the co-deposition of Au-Sn alloy is an irreversible and diffusion-controlled process and the nucleation mechanism is represented by the progressive model. The addition of catechol, which can be adsorbed on the cathode surface, increased the co-deposition overpotential, inhibited the co-deposition process and refined the grain size of the electrodeposits. Au-30at.%Sn eutectic solder has been extensively used in microelectronic and optoelectronic packaging, due to the superior mechanical and thermal conductive properties as well as the high long-term reliability. [1][2][3][4] As one of the hard solders, the relatively lower melting temperature (278 • C) of Au-Sn eutectic solder compared with those of Au-Ge (356 • C) and Au-Si (363 • C) eutectic solders, makes it ideally suitable for packaging of bonding devices those are sensitive to high processing temperatures, such as GaAs or large Si dies on alumina. Moreover, the high thermal conductivity of Au-Sn makes it suitable for bonding high-powered devices, such as high-powered LED and laser diode packaging with the demand of good heat dissipation. 5 Conventionally, Au-Sn eutectic solder is prepared by solder preform, 6 evaporation 7 and sputtering. 8 However, the Au-30at.%Sn solder fabricated using these techniques cannot meet the demand for microscale solder preparation due to the limitations of precise pattern formation and deposits thickness. As an alternative method, electrodeposition technique 9 can overcome such limitations and would be an attractive way in Au-Sn solder manufacturing.In the past decades, due to the high stability of cyanide with metallic ions, cyanide containing baths were primarily used to prepare Au-Sn alloy deposits. 10,11 However, cyanide is one of the most toxic chemicals, which is extremely harmful to human health and the environment. Furthermore, cyanide also destroys the photoresist in the process of flip chip bump preparation. To solve this problem, a number of attempts have been made to develop non-cyanide Au-Sn electroplating baths. [12][13][14] Up to now, the electrodeposition technology of Au-Sn alloys has not yet fully developed due to the l...

show abstract

Initial stages of the electrocrystallization of Co–Cu alloys on GCE from the Co rich electrolytes

Cited by 25 publications

References 18 publications

Nucleation and Growth Mechanisms in Cu–Co Films

Nucleation and Growth Mechanisms in Cu–Co Films

Influences of Cerium on the Electrodeposition Process and Physicochemical Properties of Lead Dioxide Electrodes

Study on Co-Electrodeposition Mechanism of Au-30at.%Sn Eutectic in Non-Cyanide Bath by Electrochemical Methods

Contact Info

Product

Resources

About