“…Hot-embossing involves the use of a variety flat thermoplastic sheets, such as polymethylmethacrylate (PMMA), polycarbonate (PC), cyclic olefin copolymer (COC), polystyrene (PS), polyvinylchloride (PVC), and polyethyleneterephthalate (PETG) (Becker and Locascio, 2002;Novak et al, 2013;Ren et al, 2013), which are molded against a master using pressure and heat (Locascio et al, 2006). In turn, injection molding involves the high-pressure injection of pre-polymerized molten thermoplastic granules into a heated molding cavity (Mair et al, 2006;Attia et al, 2009), which allows the high-throughput industry-scale fabrication of thermoplastic devices. A detailed description of microfabrication methods of lab-on-a-chip devices can be found elsewhere (Fiorini and Chiu, 2005;Kim et al, 2008a;Coltro et al, 2010;Sollier et al, 2011;Wu and Gu, 2011).…”