Inkjet-Printed Flexible Active Multilayered Structures

Abstract

Active inkjet materials are invoked in the fabrication of optoelectronic devices. These types of multilayer assemblies contain a variety of commercially available ink formulations. It is envisioned that a dielectric SU-8 material can be used in a FET-like structure to form an interlayer between conductive silver and semi-conductive MWCNT-doped PEDOT:PSS ink layers. These printed structures may be fabricated onto a polyimide based flexible substrate, for instance. These structures are a starting point for offering valuable information on layer-on-layer printing interactions and interface problematics within a complete inkjet device fabrication.

Sustainable Advanced Manufacturing of Printed Electronics: An Environmental Consideration

“…In recent years, the advancements in digital inkjet printing technologies have shown great promises for printed electronics. Akin to more conventional additive manufacturing strategies such as using screen printing, digital inkjet printing has been rapidly and successfully applied for rapid prototyping, low-volume production, and hybrid integration of critical components for a wide range of optoelectronic applications including energy harvesting, wearables, and biomedical sensors [26,27].…”

Contactless In Situ Electrical Characterization Method of Printed Electronic Devices with Terahertz Spectroscopy

“…It offers an attractive alternative to conventional circuit manufacturing by enabling lower-cost, maskless, and rapid production of customized electronic devices [6]. PE is compatible with a wide range of substrates, as long as they are not porous and can resist all fabrication steps, including pre- and post-printing processes [7]. In addition, various kinds of conductive, semi-conductive, and dielectric inks are now commercially available.…”

Contactless In Situ Electrical Characterization Method of Printed Electronic Devices with Terahertz Spectroscopy

“…Post-printing processes also play a key role in the manufacturing of PE devices. The most commonly used sintering approaches are conventional thermal annealing, electrical sintering, microwave, and photonic sintering by either continuous-wave laser irradiation or high-power flashing lamps [7,12]. While the spatial resolution and definition of the device are related to the printing method, the quality of the electrical properties of the printed devices is directly related…”