This study aims to establish a novel
pathway for transforming complex
electronic waste into advanced hybrid materials by leveraging high-temperature
reactions. This research utilized silica (SiO
2
) sourced
from computer monitor glass; carbon obtained from plastic components
of spent monitor shells; and copper (Cu) recovered from waste printed
circuit boards (PCBs) to produce a high-quality hybrid layer on a
steel substrate. The transformation process consisted of two steps.
In the first step, silicon carbide (SiC) nanowires were produced from
the spent monitor’s glass and plastic. In the second step,
these nanowires were combined with Cu obtained by grinding waste PCBs
to produce the hybrid layer over the steel surface. The Cu–SiC
hybrid layer on a steel substrate was produced successfully by the
judicious selection of waste sources and by selecting a microrecycling
technique, which resulted in superior mechanical properties for the
end product. This technique, proposed as ‘material microsurgery’,
has the potential to transform waste materials into new hybrid surface
coatings, which endows the base materials with superior properties
to those seen in the source materials. For example, the SiC-nanowire-reinforced
Cu layer added to steel in this study improved the hardness of the
base material.