Integrated electrical and thermal modeling and analysis of IPEMs

Chen, J.Z.; Wu, Yue; Borojevich, D.; Bøhn, Jan Helge

doi:10.1109/cipe.2000.904686

Cited by 10 publications

(4 citation statements)

References 1 publication

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“…In synthesis, our electro-thermal model has the following advantages and novelties with respect to the state-of-the-art: 1. concurrent approaches, that are mentioned in our section References [9], [13], [15], [22], [23], propose strategies that do not generate (for power modules) a final electro-thermal model split in two distinct layers, and implemented in a pure PSpice format; 2. the PSpice layers are conceived just to allow an easy implementation of iterative simulations for power modules, as described in section VII. Iterative simulations are mandatory in order to account for the parameter variations of the active devices with the temperature [23], and to allow electrical and thermal simulations of systems that have time constants that differ by several orders of magnitude such as the power modules.…”

Section: Main Advantages Of the Proposed Methodologymentioning

confidence: 99%

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Electrothermal PSpice Modeling and Simulation of Power Modules

Raciti

Cristaldi

Greco

et al. 2015

IEEE Trans. Ind. Electron.

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Integrated Power Electronics Modules (IPEMs) represent an innovative typology of power electronics assemblies able to guarantee several advantages such as increasing of power density, better management of the thermal flows and a significant reduction of the package sizes. Their characteristics make them suitable for applications like motor drives or power conditioning. IPEMs usage in emerging fields like hybrid automotive traction and electric generation from renewable energy sources is continuously increasing. In this paper, we describe the implementation of a devised flow to generate the layer-based electro-thermal PSpice model of an IPEM and the simulation flow of the model. The proposed modeling methodology allows reducing an electro-thermal multi-domain problem to an electrical single one. The general PSpice-like nature of the proposed model makes it suitable for a wide range of simulation frameworks where the integration of heterogeneous multi-physics models could be a difficult task. The outlining of both electrical and thermal PSpice layers is discussed, and the implementation into the final model, by the assistance of custom electronic design automation (EDA) flow, is presented. Besides, we describe the validation procedure of the proposed approach and the results are compared with the ones obtained by a commercial finiteelement-based package used as a benchmark. Two simulation approaches related to specific conversion systems, and related issues, are presented and discussed.

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Section: Main Advantages Of the Proposed Methodologymentioning

confidence: 99%

“…Novel modeling approaches, having the specific purpose to obtain an electro-thermal model of IPEM, date back to recent years. In such cases some techniques try to analyze the IPEM physics with the purpose to model each domain in a separate way [13].…”

Section: Introductionmentioning

confidence: 99%

Electrothermal PSpice Modeling and Simulation of Power Modules

Raciti

Cristaldi

Greco

et al. 2015

IEEE Trans. Ind. Electron.

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“…Both modeling approaches have been described in literature, and also the integration into a circuit simulation is well known (e.g. [4], [5], [6], [7], [8], [9], [10], [11]). Integrating thermal models of multi-chip modules becomes a problem when more than just a few chips should be considered, because the calculation effort of the simulation is proportional to the third order of the model size (as shown in the following), and the contribution of the thermal model might be much larger than the contribution of the power circuit.…”

Section: Introductionmentioning

confidence: 99%

Computationally Efficient Integration of Complex Thernal Multi-Chip Power Module Models into Circuit Simulators

Drofenik

Cottet

Musing

et al. 2007

2007 Power Conversion Conference - Nagoya

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For analyzing reliability or short-term overload conditions of power electronic systems, it is necessary to know transient temperatures of the power semiconductors. Directly coupling thermal and circuit simulators increases the simulation time by orders of magnitude, therefore making such an approach impractical. A well-known solution to this problem is to extract thermal equivalent circuits from 3D-field simulations and to insert them directly into the circuit simulator. In this paper we discuss the poor scaling performance of this state-of-the-art approach. There is an enormous increase in simulation time if there are more than just a few chips thermally modeled. We propose a general procedure at the circuit simulator solver level to increase the calculation speed of such a coupled simulation significantly.

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“…With the dimensions' parameters given in Table 2, the designed circular air coil has 26 Ω resistance. The amount of dipole moment generated is controlled by the amount of current [11]. Power consumption and time of rotation Power dissipated by the air coil can be calculated by…”

Section: Circular Air Coilmentioning

confidence: 99%

Design and comparison of embedded air coils for small satellites

Ali¹,

Mukhtar²,

Ullah³

et al. 2018

Turk J Elec Eng & Comp Sci

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Abstract:The paper discusses the comparison of different shapes of embedded air coils for the attitude control of small satellites. Various systems are available in the market for the attitude control of small satellites such as reaction wheels, permanent magnets, magnetic rods, and thrusters. The available systems have large size, heavier weight, and relatively higher power consumption. A miniaturized system with less power consumption and heat dissipation is required that can provide the anticipated torque. This paper focuses on the design and comparison of square and circular air coils embedded in four internal layers (i.e. 2nd, 3rd, 4th, and 5th) of the eight layer CubeSat power management tile

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Integrated electrical and thermal modeling and analysis of IPEMs

Cited by 10 publications

References 1 publication

Electrothermal PSpice Modeling and Simulation of Power Modules

Electrothermal PSpice Modeling and Simulation of Power Modules

Computationally Efficient Integration of Complex Thernal Multi-Chip Power Module Models into Circuit Simulators

Design and comparison of embedded air coils for small satellites

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